Spansion announces transition to 300mm flash memory in Silicon Valley R&D centre
Spansion Inc has announced its Submicron Development Centre (SDC), the R&D headquarters for Spansion and the nucleus of the advanced manufacturing process for all Spansion Flash products lines, has successfully completed its transition from 200mm to 300mm.
Spansion will transfer the 300mm process to Spansion's new SP1 300mm manufacturing facility as it comes on line in Japan. There is approximately twice the area on a 300mm wafer than on 200mm -- enabling more die per process run. By late 2007 Spansion plans to be producing 65nm MirrorBit Flash memory devices at its new SP1 300mm wafer manufacturing facility in Aizu-Wakamatsu, Japan, followed by 45nm in production by mid 2008. For the most advanced semiconductor equipment for geometries of 45nm and below, a 300mm wafer is required. 65nm technology can be produced on 200mm or 300mm.
