News Article
ROHM and HAAS delivers ultra-low defectivity CMP pad for advanced Copper barrier processes
Rohm and Haas Electronic Materials have introduced the EcoVision 4000 ultra-low defectivity performance CMP pad designed specifically for advanced copper barrier processes for 45 nm technology nodes and beyond.
Visionpad Product Line Adopts Application Specific Approach
Rohm and Haas announce cmp pad for Cu barrier
Rohm and Haas Electronic Materials have introduced the EcoVision 4000 ultra-low defectivity performance CMP pad designed specifically for advanced copper barrier processes for 45 nm technology nodes and beyond.
"As customers switch to advanced processes and nodes, we offer products designed for their specific polishing needs," explained Cathie Markham, vice president of technology for Rohm and Haas Electronic Materials, CMP Technologies. "The EcoVision 4000 pad is representative of this shift towards application specific pads. Throughout our entire VisionPad platform, we provide customers with the best and most cost effective solutions for their specific CMP process requirements."
The pad's manufacturing process produces a surface that results in increased contact area between the pad and the wafer. This reduces defects and improves die yields by minimizing scratches and chatter marks across the wafer resulting in best–of-class defectivity performance. Unlike soft pads, the EcoVision 4000 pad is conditioned, allowing for pad surface regeneration to achieve optimal polishing results that are consistent throughout the pad's life as well as from pad to pad.
Rohm and Haas announce cmp pad for Cu barrier
Rohm and Haas Electronic Materials have introduced the EcoVision 4000 ultra-low defectivity performance CMP pad designed specifically for advanced copper barrier processes for 45 nm technology nodes and beyond.
"As customers switch to advanced processes and nodes, we offer products designed for their specific polishing needs," explained Cathie Markham, vice president of technology for Rohm and Haas Electronic Materials, CMP Technologies. "The EcoVision 4000 pad is representative of this shift towards application specific pads. Throughout our entire VisionPad platform, we provide customers with the best and most cost effective solutions for their specific CMP process requirements."
The pad's manufacturing process produces a surface that results in increased contact area between the pad and the wafer. This reduces defects and improves die yields by minimizing scratches and chatter marks across the wafer resulting in best–of-class defectivity performance. Unlike soft pads, the EcoVision 4000 pad is conditioned, allowing for pad surface regeneration to achieve optimal polishing results that are consistent throughout the pad's life as well as from pad to pad.