News Article
Synova secures first orders in China from major semiconductor and precision metal component manufacturers
Synova, a patent holder of water jet-guided laser technology, has announced that two major Chinese customers have placed orders for systems incorporating Synova's state-of-the-art Laser MicroJet(R) technology for semiconductor and micro-machining applications.
Synova, a patent holder of water jet-guided laser technology, has announced that two major Chinese customers have placed orders for systems incorporating Synova's state-of-the-art Laser MicroJet(R) technology for semiconductor and micro-machining applications. The first customer will use Synova's Laser Dicing System, LDS 200M, for 150- and 200-mm wafer processing, and the second will use the company's versatile Laser Cutting System, LCS 300, for precise processing of small metal components. These are two new customers for Synova and represent major competitive wins, as well as a strengthened foothold in the Chinese market and throughout Asia.
In a project partially financed by the Chinese government to further develop the region's semiconductor industry, the Chinese customer will utilise Synova's LDS 200M to dice thin 150- and 200-mm silicon wafers for the manufacture of integrated circuits (ICs). Built upon Synova's Laser MicroJet technology, the LDS model is a process-validated tool that overcomes yield-reducing effects such as chipping, micro-cracking, thermal damage and contamination, which is characteristic of conventional dry lasers or diamond blade saws. Synova's system was also chosen as the preferred technology of choice for precision metal component applications based on these same advantages. The micro-machining company that is employing the LCS 300 systems selected Synova's Laser MicroJet technology for its highly precise and quality-cut results required for applications, such as the slotting of 3-mm thick aluminum (Al)-alloy plates, following unsuccessful trials with conventional lasers. The equipment will be used to manufacture components for the micro electrical motors and modules for a wide range of devices for the defense industry.
In a project partially financed by the Chinese government to further develop the region's semiconductor industry, the Chinese customer will utilise Synova's LDS 200M to dice thin 150- and 200-mm silicon wafers for the manufacture of integrated circuits (ICs). Built upon Synova's Laser MicroJet technology, the LDS model is a process-validated tool that overcomes yield-reducing effects such as chipping, micro-cracking, thermal damage and contamination, which is characteristic of conventional dry lasers or diamond blade saws. Synova's system was also chosen as the preferred technology of choice for precision metal component applications based on these same advantages. The micro-machining company that is employing the LCS 300 systems selected Synova's Laser MicroJet technology for its highly precise and quality-cut results required for applications, such as the slotting of 3-mm thick aluminum (Al)-alloy plates, following unsuccessful trials with conventional lasers. The equipment will be used to manufacture components for the micro electrical motors and modules for a wide range of devices for the defense industry.
