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News Article

Acquisition of Solvision assets by ZYGO entering semiconductor Back-End inspection market

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Zygo Corporation announced that it has acquired the assets of Solvision, Inc., a Canadian based company, including the shares of its Singapore subsidiary.
With this acquisition, ZYGO enters the market for in-line inspection of Flip Chip Substrates and Packaged Integrated Circuits. Included in the acquisition is the patented Fast Moire Interferometer (FMI) technology for rapid 3D inspection. Continued development of the FMI head and Flip Chip Substrate equipment will occur in Montreal. The Integrated Circuits Packaging inspection product line will continue to be developed and manufactured in Singapore. The deal is expected to be accretive in fiscal 2009.

"ZYGO embarked on a strategy to continue its growth by moving to in line process control applications. This is a continuation of that strategy which expands our semiconductor presence beyond the wafer," said Jim Northup, President of ZYGO's Metrology Solutions Division. He added, "ZYGO's strength in high precision metrology, coupled with the high speed vision capabilities we have just acquired, positions us very well to serve the full semiconductor market. We are pleased to enter the packaging market with advanced patented technology and the key talent provided by this acquisition."

Zygo Corporation is a supplier of optical metrology instruments, precision optics, and electro optical design and manufacturing services, serving customers in the semiconductor capital equipment and industrial markets.
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