TSMC adds high voltage features to 0.13 processes
The high-yield process features an Aluminum Copper (AlCu) backend metal scheme and is designed to meet energy reduction targets, while responding to the market’s demand for smaller line width options, reducing die size in next-generation high-resolution display driver ICs.
The growing popularity of mobile TV and internet browsing demands a new generation of portable displays that feature high resolution and excellent power performance. The new 1.5/6/32V technology cuts die size requirements for new high-resolution mobile handset display drivers, while providing the high drive voltages required at the smaller 0.13um geometry.
TSMC’s new process is particularly compact and provides the smallest SRAM bit cell of any commercial foundry, at no compromise to speed and stand-by power. It also adds the necessary core voltage under-drive range, at 1.2V, to meet the most stringent green panel requirements. Furthermore innovative new fuse implementations simplify display optimization and matching during production testing.
