Semiconductor Wafer Handling for Flip-Chip Bonder from Assembléon
Assembléon is adding wafer feeding to its A-Series Hybrid at this year's Semicon Taiwan, taking place between September 5th and 7th at, booth #966.
With this new addition, the firm believes it is increasing market share in the semiconductor industry.
The new DDF Innova Direct Die Feeder converts Assembléon's pick & place machine from a high-speed chipshooter into a high-speed flip-chip bonder, feeding devices directly from up to 300-mm wafers. The announcement follows the success of the machine at last year's Semicon Taiwan, which made Assembléon the only pick & place vendor with back end capabilities.
"Over the last 18 months, the number of Assembléon's semiconductor customers has increased significantly and the number of installations in the industry has at least doubled", said Patrick Huberts, product manager advanced applications. With the PCB-assembly and back-end worlds converging rapidly, there is a great need for single machines that can perform both high speed chip shooting and flip-chip bonding." This year, in co-operation with local representative Sigmatek, Assembléon will be at Semicon Taiwan again, showing the results of its partnership with Hover Davis for bare die feeding.
Single machine for die bonding, chip shooting and embedding at 99.99% First Pass Yield.
The A-Series Hybrid reaches controlled die bonding speeds up to 15,000 components per hour (cph) at maximum accuracy, and passive component placements up to 121,000 cph. The single-machine solution is suited to applications like System-in-Package, Multi Chip Module, flip chip bonding and embedding passive and active components into substrates. Assembléon is now introducing wafer feeding for the machine.
"This makes it a true single-machine solution, reducing investment and production costs for module manufacturers" added Huberts. "And, by using our proven parallel placement technology, it also improves the quality of manufacturers' end products "“ giving First Pass Yields of over 99.99%. Our Hybrid increases a manufacturer's flexibility by increasing the variety of components placed by one machine. It therefore optimizes valuable floor space, too. Capabilities and flexibility are increased enormously by adding wafer capabilities with the new Hover Davis DDF Innova feeder."
DDF Innova Direct Die Feeder
The new DDF Innova supplies bare die products directly from up to 300-mm (12-inch) wafers to the A-Series Hybrid. They can be presented in flip chip (bumps down) or direct die (bumps up) mode. Wafer mapping ensures that only known-good-dies with sizes from 0.7mm (any edge), are presented to the machine. The DDF Innova is a product from Hover Davis, headquartered in Rochester, NY, USA. Hover Davis has over a decade's experience in manufacturing wafer feeders for the back-end semiconductor industry.
