Cabot bags several orders for CMP slurry tools for logic devices
Cabot Microelectronics Corporation has announced that its "Novus A7100 Aluminum" CMP slurry products have been adopted by several customers to help enable 28/20 nanometre High-K Metal Gate integration schemes used for advanced logic devices.
The Novus A7100 Aluminum slurry product platform is the result of Cabot Microelectronics' CMP technology and extensive research and development in close collaboration with strategic customers.
Novus A7100 contains a combination of unique engineered abrasive particles and proprietary chemistry to remove aluminium and the complex stack of work-function metals within the transistor gates of advanced semiconductor logic devices.
This CMP solution was designed to polish aluminium and then stop on the underlying dielectric material and therefore minimise dielectric material erosion and aluminium recess. Novus A7100 is formulated to optimise removal rate, limit erosion and recess, and meet low defect requirements.
Charles Chen, Cabot Microelectronics' Global Business Director, states, "The Novus A7100 Aluminum CMP slurry provides our customers with a solution for a critical process step in enabling High-K Metal Gate device integration at advanced technology nodes. We believe the extremely low recess levels that can be achieved across a wide range of feature sizes and densities, results in better device reliability and transistor performance."
Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is a supplier of CMP polishing slurries and a growing CMP pad supplier to the semiconductor industry. The company's products play a critical role in the production of advanced semiconductor devices, enabling the manufacture of smaller, faster and more complex devices by its customers.
