News Article
Oerlikon receives multiple orders from major power device manufacturer
Oerlikon's Advanced Technologies Segment, a supplier of PVD deposition equipment, has received multiple orders for its CLUSTERLINE 300 system for use in the manufacture of power devices. CLUSTERLINE 300 is the first PVD tool worldwide that runs 300mm thin wafer backside metallisation for power devices in production. "With the new CLUSTERLINE 300, we can offer our customers significant advantages and again prove our technology leadership," says Andreas Dill, CEO of Oerlikon's Advanced Technologies Segment. In the semiconductor industry, power devices are a fast-growing market, which is primarily being driven by an increasing number of efficient energy-management requirements. What's more, modern power devices' improved efficiency and low energy usage has fuelled the replacement of conventional units. The first of Oerlikon's solutions for 200mm power device manufacturing were qualified at customer sites more than 10 years ago, and today the thin wafer handling and processing capability of the CLUSTERLINE 200 is the established solution at all major power device manufacturers and foundries. Oerlikon's years of experience with power device production processes was a key factor in achieving accelerated qualification and enabling the successful transition from 200mm to 300mm volume manufacturing.
Because a 300mm wafer has 2.25 times the area of a 200m wafer and similar throughput times, the CLUSTERLINE 300 more than doubles productivity.The platform offers both front side thick aluminium and thin wafer backside metallisation for 300mm power device manufacturing. The adaption of 300mm wafer production for power devices requires innovative solutions as well as increased automation and wafer-handling capabilities.
Following the successful on-site qualification of the system, Oerlikon has now received multiple orders for its new CLUSTERLINE 300 from a leading power device manufacturer. "We are pleased to offer customers a comprehensive solution for 300mm power device manufacturing as well, which builds on our success as leading supplier for the smaller wafer format in this fast-growing market," says CEO Andreas Dill.Oerlikon Systems focuses on production systems for advanced nanotechnology and semiconductor applications. The core competence of Oerlikon Systems in the thin-film coating technology enables solutions in the area of advanced nanotechnology for touch panels, photovoltaics, thermoelectric generators and energy storage, saving, conversion and transmission.
Applications for the semiconductor market include advanced packaging, power devices, read/write heads for hard disks, LEDs and Micro-Electro-Mechanical Systems (MEMS). These solutions facilitate the production of chips, devices and components used in consumer electronics and various industrial sectors, including the information technology, telecommunications and automotive industries.
