SÜSS MicroTec launches mask aligner for packaging
The MA12 mask aligner addresses the Advanced Packaging market including 3D wafer-level chip scale packaging and wafer-level packaging and the MEMS market
This semi-automated tool is designed for industrial research and production of wafers up to 300 mm and 300 x 300 mm square substrates.
It is one of the latest mask aligner technologies in terms of accuracy, optical performance and versatility.
The operator assisted MA12 offers high process flexibility including submicron alignment and features the MO Exposure Optics of SÜSS MicroTec, a unique illumination optics, adjustable to meet various exposure requirements.
The newly-introduced mask aligner addresses the Advanced Packaging market including 3D wafer-level chip scale packaging (3D WLCSP) and wafer-level packaging (WLP) as well as the MEMS market.
The SÜSS MicroTec MA 12 combines the advantages of a reliable manual tool specialized on the handling of delicate substrates, such as highly warped wafers and fragile substrates, with the performance of a 300mm lithography tool. Processes developed on the MA12 can be quickly transferred onto the automated SÜSS MicroTec MA300 high volume production platform.
"The MA12 has been designed to enable quick and effective development of new products and process technologies", explains Frank P. Averdung, president and CEO of SÜSS MicroTec. "Research organizations will benefit from the enhanced capabilities of the industry-compatible MA12 as it offers the flexibility needed in the development and adoption of latest llithography processes."
