+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

CEA-Leti and Corima to develop MEMS sensors for cycles

News

CEA-Leti and Corima, a supplier of carbon-composite wheels and frames for track and road-racing cyclists, are developing an integrated sensor system incorporating MEMS to measure the power output of riders as they pedal.

While there are a variety of ways to measure this key parameter for serious riders, they typically use sensors affixed to pedals or the rear-wheel axis. The compact, ultra-light force sensor developed in this collaboration will be lighter, more precise and more easily integrated in the rear wheel, assuring reliable data in all types of weather and on all roads.

"Corima has always worked with cycling professionals on both the track and road racing circuits, so we understand their needs for superior equipment and, increasingly, smart devices," says Corima Managing Director Pierre-Jean Martin. "This force sensor developed with Leti and embedded on our carbon wheels is made with those athletes in mind and will raise the standard for measuring pedal force."

The project blends Leti's experience in electronics, signal processing and wireless communication to transmit real-time information via the Internet of Things about the cyclist's pedal force. Corima is modelling the distributions of effort in the wheel.

The project is part of Leti's Development and Prototyping Platform, whose goal is to help SMEs in traditional industries improve their products and develop competitive advantages by integrating sensors and communication systems in their products. It is funded through the Easytech program of the IRT Nanoelec research institute.

"Leti's strengths in microelectronics and sensors produce versatile devices that have many potential uses, and we constantly look for potential partners who have new applications for them," Leti CEO Laurent Malier, concludes. "Working with Corima, our team came up with an innovative use for a force sensors that, when integrated in Corima's carbon wheels, apply Leti technology in a new realm and support the quantify-self movement."

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: