+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

USHIO receives order for "UX4" lithography system from institute


USHIO INC has announced that the company has received an order for its UX4 large-area, full-field projection lithography from a German research institute, CiS Forschungsinstitut fuer Mikrosensorik und Photovoltaik GmbH (hereafter CiS), through its wholly owned subsidiary USHIO EUROPE B.V. The UX4 system, which is optimized for research and development as well as for manufacturing of MEMS devices, is scheduled to be delivered to CiS in November.

The UX4 system uses a full-field projection exposure method that is completely non-contact, so as to cause no damage to the mask or wafer, and allows high-precision exposure of stepped substrates or thick photoresist. USHIO provides its UX4 systems customized for a variety of devices, including MEMS and power devices, as the UX4 Series. The UX4 system includes a series of powerful features such as a proprietary alignment technology that enables easy detection of low-visibility alignment marks, simultaneous projection on both sides of a wafer to enhance productivity, the capability for full-field exposure of up to 200-mm wafers, and a maximum resolution of 2 µm L/S.

"We have been using a proximity exposure system, but have realized the necessity for switching to another exposure method to meet the needs of finer patterns and higher productivity. USHIO's full-field projection exposure lithography system fully satisfies our requirements. I believe that it will enable us to accelerate our research and make a great contribution to enhancing the productivity of MEMS devices and compound semiconductor devices, as well as to increasing the precision and density of these devises," commented Dr. Thomas Ortlepp, Director of the Research, Development, and Technology, CiS.

"The UX4 is mounted with USHIO's originally developed projection lens to allow full-field projection exposure without coming into contact with the mask or wafer. We expect that CiS will be able to accelerate its research and development, thus enabling enhancement of productivity as well as reduction of the cost for manufacturing MEMS devices in Europe," commented Masayuki Itaba, General Manager of the Exposure Business Unit, USHIO INC.

USHIO will be at Booth 235 at SEMICON Europa 2014, to be held on October7 through 9 in Grenoble, France. There, it will exhibit its UX Series lithography systems including this UX4 system through a panel display under the slogan "USHIO Full-Field Projection" to provide optimum solutions for next-generation packaging applications.


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: