NANIUM's latest WL3D solution reduces space required by 5X
NANIUM S. A., has announced it has developed a 3D Wafer-Level System-in-Package (WLSiP/WL3D) solution that integrates more than 40 different components. The final units measure 8 mm x 8 mm x 1 mm and are Fan-Out Wafer-Level Packages, produced on large diameter reconstituted wafers, a technology with proven volume manufacturability that was developed in-house.
"We were challenged by a customer to develop a package with several active and passive components including a large number of SMD parts - so far assembled on a PCB based module - in a single System-in-Package" explains Elisabete Fernandes, the responsible project manager. "To achieve a small form-factor, we had to attach an active silicon die as a hanging die (WLCSP) at the bottom side of the package inside the Ball Grid Array (BGA). The combination of these technologies enabled highly dense side-by-side (2D) and face-to-face (3D) assembly, ultimately reducing the original space required for this functionality by 5X."
The resulting package was qualified and, according to the customer, NANIUM's units not only achieve the same performance as the previously used PCB based module solution, but even exceed them in what concerns electrical performance. This was only possible due to the reliance on Wafer-Level Fan-Out (WLFO), the fastest-growing advanced packaging technology in the industry, capable of enabling Wafer-Level System-in-Package (WLSiP) and heterogeneous 3D integrated package solutions (WL3D).
This type of densely packed system solution is especially applicable to space constrained applications like wearables, health and well-being, sports and fitness, autonomous vehicles like cars and drones, and IoT devices in general.
NANIUM recently published a new datasheet "Embedded Wafer-Level System Integration (WLSiP & WL3D)", and will be presenting the above solution at the "SEMI European 3D Summit", along with other Wafer-Level Packaging technology innovations. The event will be held in Grenoble, France from January 18th to 20th, 2016.
