News Article
Kulicke & Soffa Extends Memory Solutions with Launch of Wire Bonder Series
Kulicke & Soffa Industries has announced the launch of IConnPS MEM TM PLUS Wire Bonder series.
The IConnPS MEM TM PLUS is built on the successful IConn PLUS wire bonder platform, with newly developed hardware and process capabilities to improve throughput and yield, targets the growing complexities of stacked-die memory applications.
Nelson Wong, Kulicke & Soffa's Vice President of Ball Bonder Business Line, said, "We continue to align our development efforts to enable the next generation of industry solutions. This series directly targets the memory segments requirements for high-reliability interconnects on an increasing stack of progressively thin die."
