Expanded Range Of Process Carriers For Wafer And Substrate Handling From Plan Optik
Semiconductor wafers undergo a wide range of process steps. Most tools could handle standard wafer diameters only. In order to accomadate the possibility of processing smaller or differently shaped wafers or other substrates, Plan Optik AG, the manufacturer of glass, quartz and glass-Si compound wafers, has expanded its production range on carriers for the handling of small semiconductor wafers as well as small substrates for various applications.
Process carriers by Plan Optik consist of either surface processed silicon wafers (pockets which hold smaller dimensions) or a combination of a blank silicon wafer with a bonded glass carrier on top. Boundless possibilities are available. These process carriers are available in many combinations (300 mm to 200 mm, 200 mm to 150 mm, etc.). Even multiple small substrates could be handled (e.g. four 3“ wafers on one 200 mm carrier or hundreds of smaller sizes such as 10 mm x 10 mm substrates).
Plan Optik‘s process carriers are fitting to many semiconductor or MEMS related processes. High temperature and chemical resistance, incredible low tolerances, thermal expansion adjusted to silicon or other substrate materials are available. Special non sticking or sticking surface properties could be implemented. A perfect surface quality created by Plan Optik‘s well established double side polishing and unique laser marking including QR codes for easy process tracing make them suitable for a huge number of re-use cycles.