ULVAC offers state-of-art products and technologies for semiconductor and related processes. To support MEMS, power devices, NVM, Logic and Packaging fabrication, ULVAC offers a line of equipment and technologies for sputtering, evaporation, PECVD, plasma etching, ashing and ion implanting for both mass production and R&D from 150mm up to 300mm. To adopt specific requirements we offer various cluster tool platforms for sputtering, plasma etching, PECVD and ashing. For evaporation a production system up to 200mm wafer size is available offering fully automatic loading of wafers between dome and cassettes. For Al etching we offer an etching platform including rinse and ashing modules to overcome corrosion. For all systems we offer free sampling in our demo lab.