ULVAC

ULVAC’s solutions diversely incorporate equipment and technology for Power Devices, MEMS, NVM, Logic, LED, Flat Panel Displays, Packaging, PCB, TFB and others manufacturers. For compound semiconductor applications ULVAC has developed systems dedicated to SiC and GaN devices as well as Laser and LED. This equipment range includes SiC trench and mask etching, hot ion implanting for SiC, medium current implanting for GaN, sputtering of metals and carbon cap, resist ashing, high selective etching of GaN and AlGaN and others. For all systems we offer free sampling in our demo lab.

Contact: Kaoru Takano   Website: https://www.ulvac.eu
Phone: +49-89-9609090   Email: ulvac@ulvac.de
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