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Tuesday 22nd October 2013
Monday 21st October 2013
Developed on TSMC's CoWoS 3D IC process the devices produce significant silicon scaling, power and performance benefits by integrating multiple components on a single device
Monday 21st October 2013
With the appointment of Alf-Egil Bogen, the company is gaining a semiconductor industry veteran with corporate marketing and branding expertise
Monday 21st October 2013
The new centre will provide a comprehensive one stop full service to customers
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Monday 21st October 2013
This process is implemented on SOI substrates for applications such as audio amps, DC-DC converters and PMICs for the mobile and consumer markets
Monday 21st October 2013
Sunday 20th October 2013
Profits soared to a 11 quarter high. This represents the highest profitability since the 33 percent level attained in the third quarter of 2010
Sunday 20th October 2013
An optical information carrier composed of tungsten and silicon nitride can store information for extremely long periods of time, with each bit being written using etching techniques
Sunday 20th October 2013
The company’s ticker symbol  will remain “FCS”
Sunday 20th October 2013
The new silicon based devices help battery pack designers simplify their design and minimise footprint area
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Sunday 20th October 2013
The second phase of the trial addressing damages and wilfulness is set to begin
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Tuesday 15th October 2013
ASM220 is suited to OFDM PLC machine-to-machine applications
Tuesday 15th October 2013
Tuesday 15th October 2013
This move is expected to accelerate InvenSense's audio roadmap and expand its product portfolio and technology expertise

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