Soitec (Euronext Paris) unveiled its new expansion development strategy aimed at addressing the growing worldwide demand for SOI and other engineered substrates. To this end, the company reports it is expanding its existing production capacity base in France, while also augmenting its global industrial presence with a new production plant based in Singapore.
CMC Interconnect Technologies, continue to expand their capabilities for Ceramic Substrate, Module and Package Rework. With focus on complex and high dollar value ceramic products, "rework is the refurbishing of material " for reuse in production. Reworked ceramic substrates will meet the same quality standards and product reliability specifications as new incoming substrates, with a significantly lower material cost.
SUSS MicroTec announced that AZ Electronic Materials USA Corp has purchased a resist qualification modular cluster from SUSS MicroTec. It will be used to optimise the coat, bake, and develop performance of AZ's existing thin and thick resists, as well as for the evaluation of newly developed materials.
MEMSCAP (Euronext: MEMS) announces it has signed an agreement of sale of its Bernin manufacturing plant.The Company has concluded with SOITEC (Euronext : SOI) an agreement of sale of its Bernin manufacturing site for a net amount of 13 million euros, which includes the transfer of the existing site lease-back agreement. This sale would totally annul MEMSCAP financial liabilities (with a net cash over 10 million euros) and would enable the Company to increase its cash by more than 7 million.
Clearwire Corporation, announced a series of transactions with Intel Capital, the venture capital investment arm of Intel Corporation, Motorola and Motorola Ventures to accelerate the development and deployment of portable and mobile WiMAX networks based on the IEEE 802.16e-2005 standard. The transactions include Intel Capital's investment of $600 million as part of a $900 million private financing round and Motorola's acquisition of Clearwire's subsidiary NextNet Wireless. Motorola Ventures is also participating in the financing round.
GuideTechannounced the signing of ZMC Technologies Pte Ltd. in Singapore as their new Southeast Asia distributor to meet GuideTech's growing need for sales and support of the Femto 2000 and GT4000 CTIA family of integrated ATE solutions in Singapore, the Philippines, Malaysia and other parts of Southeast Asia.
KLA-Tencor Corp. announced that a Special Committee of the Company's Board of Directors has reached a preliminary conclusion that the actual measurement dates for financial accounting purposes of certain stock option grants issued in prior years likely differ from the recorded grant dates of such awards.
Ten manufacturers of thick film microcircuits have come together to form a new alliance that will provide engineers with a central resource of information on how to use this technology and maximise its benefits in custom electronics design.
Data released for May shows reassuring signs for the European market: year-on-year growth on a 3 month average basis has turned slightly positive when measured in dollars and the pace of the growth appears stronger when measured in Euro.
SMSC announced that it has launched a translated version of its website for the China market. Visitors may now access corporate, product and market information in Simplified Chinese through SMSC's Chinese domain.
Responding to the startling announcement of Intel's cellphone processor division sale to Marvell, the Handset Component Technologies Service of Strategy Analytics has released an analysis of the $600 million Intel-Marvell deal, "Intel Crashes Out of Cell Phone Business. Can Marvel Do Any Better?" This report highlights some of the problems that Intel faced during its seven years in the cellular processor industry, and how these issues could be resolved by new ownership.
Renesas Technology Corp. announced that it has decided to establish a new building in Ho Chi Minh City to expand its development and design capability for its Vietnam design subsidiary. Renesas Design Viet Nam Co., Ltd. (RVC) With the approval for an increase in capital by the Ho Chi Minh City Export Processing Zone Authority, Renesas will start the construction of the new building once a construction permit is issued. The operations in the new building will begin in September 2007.
Semiconductor Manufacturing International Corporation ("SMIC"), announced that the first 12-inch (or 300mm) fab in Central China began construction in the Wuhan East Lake New Technology Development Zone, Hubei Province, China. The groundbreaking ceremony was attended by Yu Zheng Sheng, Politburo member of Central Committee and Secretary of Hubei provincial party, Luo Qing Quan, Governor of Hubei Province, Chen Yu Jie, Director of the Overseas Chinese Affairs Office of the State Council, Li Hai Feng, Deputy Director of the Overseas Chinese Affairs Office of the State Council and Richard Chang, President and CEO of SMIC.
Freescale Semiconductor has expanded its operations in Bucharest, Romania, with new facilities and a growing staff focused on developing next-generation wireline and wireless communication technologies. The company marked the opening of its new software development centre during an inaugural ceremony attended by Freescale executives, customers and Romanian government officials. ;Freescale's research and development priorities at the software development centre include infrastructure applications for voice/modem/fax over IP (VoIP/MoIP/FoIP), network equipment and infrastructure, software for 3G cellular platforms, ZigBee stack development and integrated development tools (debuggers, compilers and performance analysis tools) for Freescale processors. ;
Marvell Technology Group, Ltd. and Intel Corporation have announced they have signed an agreement for Intel to sell its communications and application processor business to Marvell. The sale will enable Intel to focus its investments on its core businesses, including high-performance, low-power Intel Architecture-based processors and emerging technologies for mobile computing, including Wi-Fi and WiMAX broadband wireless technologies.