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Monday 9th June 2003
IBM Mainz, Germany
Monday 9th June 2003
Annual Semiconductor Industry Meeting
Monday 9th June 2003
IBM Mainz, Germany - Online Auction Closing 17th June 2003. Wafer Fab Tools & Inspection including Veeco Ion Beam Mill, Micrion Focused Ion Beam, RIE Tools, Agilent Hard Disk Drive Head Test, Plasma Asher, Mobile Dessicators, Stainless Steel Trollies, ESD Chairs, Optical and Electronic Inspection, For full sale details: click here
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
Mykrolis and Nor-Cal Products have entered into a limited strategic cross distribution alliance to provide complementary chamber critical measurement and control technology to the global semiconductor equipment industry.
Monday 9th June 2003
ULM-photonics is sampling its new 850nm Transsub VCSEL laser that operates at 3.125Gbit/sec.
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Monday 9th June 2003
German electronic design automation (EDA) developer Keil and French intellectual property supplier DOLPHIN Integration have jointly developed a hardware/software (HW/SW) coverification platform aimed at system designs involving mixed-signal system chips (SoC), micro-electro-mechanical systems (MEMS) and 8051 processors.
Monday 9th June 2003
A model for the electrical activity of hydrogen in almost any material - semiconductor, insulator and even aqueous solution - has been developed by Chris G Van de Walle of the Palo Alto Research Center (PARC) and J Neugebauer of Berlins Fritz Haber Institut der Max Planck Gesellschaft (Nature, June 5, 2003).
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Info
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Sunday 8th June 2003
Applied Materials says it has produced the industrys first 90nm test chip for X Architecture interconnect designs at its Maydan Technology Center in California.
Sunday 8th June 2003
Motorola reports its first volume shipments of microprocessors produced using a low-k insulating dielectric during its copper metallisation process on 200mm wafers.
Friday 6th June 2003
MOSAID Technologies has filed an amended answer and counterclaim in its litigation with Infineon Technologies in the Northern District of California.
Friday 6th June 2003
Bookham Technology says it is launching the first European-based commercial processes to use 150mm wafer technology for producing GaAs monolithic microwave ICs (MMICs). Only a handful of foundries world-wide have this capability. Initial production will start in late 2003. The new 150mm wafer process will increase per-wafer device volumes by up to a factor of four.
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Thursday 5th June 2003
OptoLum has been awarded a US patent on removing heat from densely packaged LEDs No.6,573,536). The techinque uses one of the fundamental rules of nature on earth – heat rises.
Thursday 5th June 2003
ULM-photonics is sampling its new 850nm Transsub VCSEL laser that operates at 3.125Gbit/sec. The GaAs VCSEL was grown as a bottom emitter with topside P and N contacts.
Thursday 5th June 2003
Wednesday 4th June 2003
Great riches have resulted from the smaller, better, faster electronics that have been made possible by semiconductors over the past half-century. Those who traditionally worked to minaturise electronics are now looking to other applications for new business opportunities. A few have already managed to make new businesses in sensor and other micro system technologies – accelerometers for airbag deployment, inkjet cartridge parts, thin-film heads for hard disks, structures for microphones and so on. Business constellation These new applications move beyond electronics to mechanics, optics, chemistry, biology, electomagnetic field detection . . . The new business – or perhaps more accurately the new constellation of businesses – faces many challenges. These include building new standards and new industrial consortiums and organisations. Technical challenges include finding the most suitable packaging and test strategies for sensitive, delicate devices that must also interact with their environment. Newsletter for a changing world Our new OptoMEM newsletter plans to chronicle these developments and promote the commercialisation of these exciting products. Get in touch for new opportunities Send us your e-mail address to be put on our list. Send us your news. Contact us for marketing opportunities and sponsorship. Sign-up to scott@angelbc.co.uk News to mc@angelbcl.co.uk Sponsorship enquiries to bz@angelbcl.co.uk
Wednesday 4th June 2003
German electronic design automation (EDA) developer Keil and French intellectual property supplier DOLPHIN Integration have jointly developed a hardware/software (HW/SW) coverification platform aimed at system designs involving mixed-signal system chips (SoC), micro-electro-mechanical systems (MEMS) and 8051 processors.
Tuesday 3rd June 2003
Mitsubishis Semiconductor division introduced the ML9xx40 Series of distributed feedback laser diodes (DFB-LD), which enables 2.5Gbps-100km transmission in a 0-85C temperature range. Samples are to be available in June 2003 with mass production scheduled to begin August 2003.

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