Info
Info
News search:

< Page of 414 >

News


Monday 14th July 2003
Micro Lithography (MLI) is to supply pellicles to DuPont Photomasks under a multi-year agreement. DuPont will begin ramping-down internal pellicle production at its facility in Connecticut immediately, ending production by September 2003. DuPont Photomasks' global workforce will be reduced by 5% (96 positions) once the move has been completed.
Monday 14th July 2003
Intellectual property company Rambus along with Toshiba and Elpida announced XDR DRAM technology.
Monday 14th July 2003
Matsushita Electric Industrial says it will start the world's first mass production of FeRAM (ferroelectric random-access memory)-embedded system-on-chips (SoC) using a 0.18micron process.
Monday 14th July 2003
Researchers at Infineon Technologies claim to have set a new world-speed record for silicon chips.
Monday 14th July 2003
Three scientists from the University of Massachusetts Amherst and the Hong Kong University of Science and Technology have developed microcoolers based on AlGaAs superlattices (Applied Physics Letters, July 14, 2003).
Monday 14th July 2003
IMEC has launched two industrial affiliation programmes (IIAPs) targeting sub-45nm processes. The first programme aims at improving device performance by implementing strained silicon (Si) in the transistor channel for scaled planar MOS devices. The second will exploit the high-mobility features of germanium (Ge) to fabricate high-performance CMOS transistors. The programmes are inter-linked with IMEC's present advanced CMOS research programmes.
Info
Monday 14th July 2003
Nikon has obtained a "significant" order for its NPS3301 300mm chemical mechanical planarisation (CMP) system that will be shipped to a leading development facility in Japan. The system will be focused on advanced 65nm copper/low-k interconnect polishing. Shipment is due this month, July 2003.
Monday 14th July 2003
Scientists at Tohuku university and the Semiconductor Spintronics Project of the Japan Science and Technology Corporation have been studying the use of electric fields to enable magnetisation reversal in ferromagnetic semiconductors (Sciencexpress report, July 10, 2003, 10.1126/science.1086608).
Monday 14th July 2003
BOC Edwards has been awarded a high-purity carbon dioxide supply contract from a major US semiconductor manufacturer for its supercritical CO2 process.
Monday 14th July 2003
IMEC has launched two industrial affiliation programmes (IIAPs) targeting sub-45nm processes. The first programme aims at improving device performance by implementing strained silicon (Si) in the transistor channel for scaled planar MOS devices. The second will exploit the high-mobility features of germanium (Ge) to fabricate high-performance CMOS transistors. The programmes are inter-linked with IMEC's present advanced CMOS research programmes.
Monday 14th July 2003
BOC Edwards has been awarded a high-purity carbon dioxide supply contract from a major US semiconductor manufacturer for its supercritical CO2 process.
Monday 14th July 2003
Nikon has obtained a "significant" order for its NPS3301 300mm chemical mechanical planarisation (CMP) system that will be shipped to a leading development facility in Japan. The system will be focused on advanced 65nm copper/low-k interconnect polishing. Shipment is due this month, July 2003.
Info
Monday 14th July 2003
The European Commission has decided to approve investment aid of EUR98mn for the setting up of a research and development facility for optical photomasks in Dresden, Germany.
Monday 14th July 2003
Chartered Semiconductor Manufacturing has signed a multi-year agreement to provide volume manufacturing for Infineon Technologies. The manufacturing agreement includes Infineon’s OptiMOS technology with potential extension to its CoolMOS process.
Thursday 10th July 2003
Researchers at New York’s Rensselaer Polytechnic Institute (RPI) have created minaturised gas ionisation sensors based on multi-wall carbon nanotube (MWNT) elements (Nature, July 10, 2003).
Wednesday 9th July 2003
The European Commission has decided to approve investment aid of EUR98mn for the setting up of a research and development facility for optical photomasks in Dresden, Germany.
Wednesday 9th July 2003
Chartered Semiconductor Manufacturing has signed a multi-year agreement to provide volume manufacturing for Infineon Technologies. The manufacturing agreement includes Infineon’s OptiMOS technology with potential extension to its CoolMOS process.
Wednesday 9th July 2003
EV Group (EVG) has concluded an order for a complete micro-electro-mechanical system (MEMS) process line at Silex Microsystems of Sweden.
Info
Wednesday 9th July 2003
Cool Chips and Rolls-Royce have signed a term sheet with a view to a license agreement that would give Rolls-Royce exclusive, worldwide rights to use Cool Chips’ solid-state cooling technology.
Tuesday 8th July 2003
Infineon Technologies' Emerging Technology Labs team has developed a fault-tolerant, self-organising embedded microcontroller network, which, coupled with sensors and LEDs, can be integrated into industrial or commercial textiles.
Tuesday 8th July 2003
Infineon Technologies' Emerging Technology Labs team has developed a fault-tolerant, self-organising embedded microcontroller network, which, coupled with sensors and LEDs, can be integrated into industrial or commercial textiles.
Tuesday 8th July 2003
Founded in 1986, the SEZ Group is the pioneer of single-wafer, wet-cleaning systems used in the fabrication of the integrated circuits (ICs) used to power today’s state-of-the-art electronic devices. SEZ delivers innovative, highly reliable products designed to meet the increasingly complex and demanding needs of today’s leading semiconductor manufacturers—delivering superior productivity at a low cost of ownership. The company’s proprietary spin-processing technology serves as the chief architecture within its broad portfolio of wafer cleaning and decontamination solutions. The company attributes its success to date on a number of factors, which include its global presence and localized support capabilities, its strong balance sheet and its proven technology and market leadership in anticipating chipmakers’ current and future requirements. SEZ helped pioneer the single-wafer wet-clean market over a decade ago, introducing its first single-wafer tool in 1990 and debuting its 300-mm single-wafer wet clean system in 1997. The company has 700 systems, representing almost 1,000 wet-clean chambers, installed worldwide—totaling approximately 80 percent of all the single-wafer wet-clean tools currently in the field. In addition, more than 40 percent of the single-wafer systems SEZ sold in 2002 were 300-mm tools, demonstrating the growing demand for single-wafer processing in the manufacturing of these advanced wafer diameters. To support its growing global customer base, SEZ maintains a significant presence throughout Europe, Asia-Pacific, Japan and North America. Employing more than 600 people around the world, the company reported sales of CHF 199 million / US$128 million in 2002. Registered in Zurich, Switzerland, SEZ Holding has been listed on the SWX Swiss Exchange under the symbol SEZN since 1996. Contact Information Corporate PR Contact Heinz Oyrer Phone: +43 4242 204-455 Fax: +43 4242 204-469 Email: h.oyrer@at.sez.com Investor Relations Monika Kraker Phone: +43 4242 204-455 Fax: +43 4242 204-469 Email: m.kraker@at.sez.com
Tuesday 8th July 2003
Click here for more information about the Da Vinci Platform Founded in 1986, the SEZ Group is the pioneer of single-wafer, wet-cleaning systems used in the fabrication of the integrated circuits (ICs) used to power todays state-of-the-art electronic devices. SEZ delivers innovative, highly reliable products designed to meet the increasingly complex and demanding needs of todays leading semiconductor manufacturers—delivering superior productivity at a low cost of ownership. The companys proprietary spin-processing technology serves as the chief architecture within its broad portfolio of wafer cleaning and decontamination solutions. The company attributes its success to date on a number of factors, which include its global presence and localized support capabilities, its strong balance sheet and its proven technology and market leadership in anticipating chipmakers current and future requirements. SEZ helped pioneer the single-wafer wet-clean market over a decade ago, introducing its first single-wafer tool in 1990 and debuting its 300-mm single-wafer wet clean system in 1997. The company has 700 systems, representing almost 1,000 wet-clean chambers, installed worldwide—totaling approximately 80 percent of all the single-wafer wet-clean tools currently in the field. In addition, more than 40 percent of the single-wafer systems SEZ sold in 2002 were 300-mm tools, demonstrating the growing demand for single-wafer processing in the manufacturing of these advanced wafer diameters. To support its growing global customer base, SEZ maintains a significant presence throughout Europe, Asia-Pacific, Japan and North America. Employing more than 600 people around the world, the company reported sales of CHF 199 million / US$128 million in 2002. Registered in Zurich, Switzerland, SEZ Holding has been listed on the SWX Swiss Exchange under the symbol SEZN since 1996. Contact Information Corporate PR Contact Heinz Oyrer Phone: +43 4242 204-455 Fax: +43 4242 204-469 Email: h.oyrer@at.sez.com Investor Relations Monika Kraker Phone: +43 4242 204-455 Fax: +43 4242 204-469 Email: m.kraker@at.sez.com Click here for more information about the Da Vinci Platform
Monday 7th July 2003
X-FAB Semiconductor Foundries announced an expansion of its MEMS product line to include surface micromachining technology for absolute pressure sensors. The technology enables integration of absolute pressure sensors with X-FAB's CMOS technologies. The sensors can also be implemented as discrete components.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}