Researchers have made progress in producing n-type diamond with high conductivity (Nature Materials, July 2003). Diamond is an attractive material in terms of its electrical, optical thermal and chemical properties. However, creating n-type conduction in the material has been a major challenge. Phosphorus doping has only achieved properties that are unsatisfactory for most device applications.
Omron of Japan will begin selling its D6F MEMS flow sensor from July 1, 2003. This flow sensor is produced on proprietary micro-electro-mechanical system (MEMS) technology. The company claims that it has produced the world's smallest, supersensitive MEMS technology flow sensor elements realising a size reduction to 1/7th that of flow sensors in the same class.
Praxair and the HC Starck affiliate of Bayer AG have formed an alliance to develop, manufacture and supply colloidal silica slurries for the semiconductor chemical mechanical planarisation (CMP) market. The slurries will be marketed and sold globally by Praxair Electronics.
XenICs introduced its new infrared focal plane camera XEVA-USB. This camera has a near-infrared InGaAs imager with a resolution of 320x256pixels. The system is sensitive to radiation of wavelengths between 0.9mm and 1.7mm. This part of the spectrum is fully complementary to the sensitivity range of standard CCD cameras.
Semiconductor equipment supplier SCP Global Technologies (SCP) has formally registered its newly-acquired European facility as SCP Germany GmbH. This brings the Pliezhausen facility in Germany into the corporation.
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years’ time. An agreement between three major companies, two investment funds, and a spin-off company from the Uppsala University Angstrom Solar Centre will be the launch pad for the new development.
Ultratech says that it has successfully developed what it believes to be the IC industrys first laser thermal processing (LTP) technology. The company believes that this will allow manufacturers to scale down to the 20nm technology node. The new technology is the result of nearly nine years of intensive development. LTP uses laser heating, which can be focused at specific areas of the wafer, rather than across the wafer as happens in furnaces or with rapid thermal processing (RTP).
Daw Technologies has announced the continuation of long-term maintenance services for the specialist cleanroom facilities at the Scottish Microelectronics Centre (SMC). Daw was chosen to build the centre three years ago and has been closely involved with all subsequent expansions.
SUSS MicroTec announced new capabilities for cost-effective 1X full-field lithography (1XFFL) with a package of four new technologies. Known collectively as SupraYield, the enhancements provide a high-performance 1XFFL solution for advanced thick-resist applications, such as wafer-level packaging, MEMS and optoelectronics.
Micronas introduced what it calls "ActivePackage" – aimed at ridding a headache car manufacturers worldwide have shared for many years. During the life cycle of a car, several of the original integrated circuits (IC) that are designed in when the car is launched become obsolete - forcing car manufacturers to carry out expensive redesigns.
Surface Technology Systems (STS) unveiled its Pro family of plasma etch and deposition tools aimed at the transition from the "technology driven" era of micro-electro-mechanical system (MEMS) technology into volume production.
Oxford University is looking for partners to help it commercialise a simple treatment technique for purifying crude samples of single and multi-walled carbon nanotubes (SW and MW-CNTs) to produce a clean, well dispersed product currently containing greater than 90% semiconducting CNTs.
X-FAB Semiconductor Foundries announced an expansion of its MEMS product line to include surface micromachining technology for absolute pressure sensors. The technology enables integration of absolute pressure sensors with X-FAB's CMOS technologies. The sensors can also be implemented as discrete components.
The new Pro generation of equipment platforms from Surface Technology
Systems drives down the cost-per-die for single wafer plasma processes
across a wide range of applications. The platforms are available with the
full compliment of STS' well-established plasma etch and deposition sources
in loadlocked or cluster format.
The Pro range delivers a compact footprint, with the latest generation of
PLC-based control system providing enhanced communications, reliability and
functionality coupled with faster and simpler maintenance operations. An
improved user interface, conforming to SEMI E95 further improves the
intuitive look and feel of the systems.
For MEMS silicon micromachining applications etch rates of up to 20
microns/min are available, and for optical devices, sidewall smoothness of
20nm are reproducibly demonstrated. A new showerhead design for PECVD
processes delivers exceptional deposition rates and uniformity. For
example, for optical waveguide applications, 7800 angstroms/min for BPSG
clad and 4500 angstroms/min for Ge-doped silica core layers. Greater
yields, reduced cleaning and minimal consumable parts combine to reduce
further the cost-per-die for both etch and deposition processes.
For further information, click
http://www.stsystems.com/latest_news/Pro_news5.html, or Email:
Surface Technology Systems plc,
tel. +44 1633 652400
A NUMBER OF YEARS THERE HAS BEEN INDUSTRY DISCUSSION ON THE MERITS OF
SINGLE WAFER PROCESSING AS OPPOSED TO BATCH WAFER PROCESSING. ALTHOUGH
THE BATTLE CONTINUES EARLY ANALYSIS SUGGEST SINGLE WAFER PROCESSING MAY
BE FASTER OVERALL. HEINZ OYRER, DIRECTOR OF STRATEGIC MARKETING AT SEZ
DISCUSSES THE BENEFITS OF THE NEW RANGE OF SINGLE WAFER CLEANERS TO COME
FROM SEZ AND HOW THEY WILL UP THE ANTE FOR SINGLE WAFER PROCESSING.