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Tuesday 23rd October 2007
Samsung Electronics Company Ltd., has announced that it has developed the world‘s first 64 Gigabit (Gb) multi level cell (MLC) NAND flash memory chip, using 30-nanometer (nm) class process technology.
Tuesday 23rd October 2007
Vitex Systems, Incorporated, a leading technology developer, licensor and engineering service provider for thin-film encapsulation and moisture barrier films, has announced that its equipment licensee, Advanced Neotech Systems (ANS) of Korea, has secured a purchase order for its Guardian thin-film encapsulation system from a major Japanese customer.
Tuesday 23rd October 2007
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, has announced the grand opening of a second 371,000 square ft manufacturing facility in Shanghai, China.
Tuesday 23rd October 2007
Fueled by strong revenue growth, French-based Tronics Microsystems have announced it is the first pure-play contract manufacturer of advanced MEMS devices to achieve consistent profitability.
Monday 22nd October 2007
MEMSCAP, a provider of innovative solutions based on micro-electromechanical systems (MEMS) technology, has announced it earnings for quarter three, 2007.
Monday 22nd October 2007
SanDisk Corporation, have outlined plans currently being worked out with its long-standing manufacturing partner Toshiba for the construction and ramp of a new 300mm facility, dubbed Fab 5, for NAND flash production.
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Monday 22nd October 2007
LDK Solar Co., Ltd. announced that it has signed a three-year contract to supply multicrystalline solar wafers to Canadian Solar Inc.
Friday 19th October 2007
The Bosch Group has celebrated the completion of its new headquarters and expansion of its Technical Centre in Yongin, Gyeonggi with government officials, customers, other business partners and associates.
Friday 19th October 2007
Foundry, Semiconductor Manufacturing International Corporation (SMIC) and Magma Design Automation Incorporated, a provider of semiconductor design software, have jointly announced the availability of an enhanced low-power IC implementation reference flow for SMIC's 90-nanometer (nm) process featuring Magma's Blast Power, Blast Fusion, and Blast Create.
Friday 19th October 2007
The pressure for shorter times to market is pushing electronic equipment manufacturers to look beyond their trusted supply chain for quick delivery of components which are difficult to source. This has led to the growth of component counterfeiting. A recent report estimated the losses to customers falling victims of counterfeiters exceeded US$15 billion per annum.  
Thursday 18th October 2007
It has been announced that Sony are to sell its advanced computer chip operations to Toshiba.
Thursday 18th October 2007
Robert Bosch GmbH has purchased an Omega fxP etch system from Aviza Technology, for deep silicon etch processes required in its MEMS device manufacturing.
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Thursday 18th October 2007
It has been reported that amid some major changes taking place at the 45-nm node and beyond, Axcelis Technologies Inc. has decided to cease future product development in the rapid thermal processing (RTP) tool arena.
Thursday 18th October 2007
Hynix Semiconductor Inc. has announced that third-quarter profits fell a sharp 56% on a failure to achieve expected cost reductions and a slump in memory chip prices.
Thursday 18th October 2007
Renesas Technology Europe has announced an expansion to its successful SH708x-line-up with a version of the SH7083F Flash microcontroller in a compact 10x10mm and 1.4mm thickness BGA package.
Thursday 18th October 2007
STMicroelectronics has introduced its new automotive-grade application processor with embedded GPS for navigation and telematics. The Cartesio processor perfectly couples with ST's GPS RF chip (STA5620), creating a unique offering that significantly reduces the form factor and bill-of-materials with no compromise in performance.
Thursday 18th October 2007
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Thursday 18th October 2007
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Wednesday 17th October 2007
According to United Press International, U.S. scientists have found an easy-to-produce semiconductor material can bend light in the opposite direction from all naturally occurring materials.
Wednesday 17th October 2007
It has been reported that automotive, telecom and power sectors will drive the growth rate of the semiconductor industry in India, despite the decline in the global growth rate.
Wednesday 17th October 2007
Shares of Sanyo Electric Co. have fallen in Tokyo after the electronics maker abandoned negotiations with Advantage Partners LLP over the sale of its semiconductor-making business.
Wednesday 17th October 2007
Intel Capital, Intel's global investment organisation, has announced that it is the sole investor in a US$11 million round of funding into Jordan Valley Semiconductors Ltd.
Wednesday 17th October 2007
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced the successful installation of its fourth IQ Aligner System for packaging applications at a major semiconductor manufacturing facility in Austria.
Wednesday 17th October 2007
IMEC has reached an agreement with ASML to install an ASML EUV pre-production tool in IMEC's 300mm facility in 2010.

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