Vitex Systems, Incorporated, a leading technology developer, licensor and engineering service provider for thin-film encapsulation and moisture barrier films, has announced that its equipment licensee, Advanced Neotech Systems (ANS) of Korea, has secured a purchase order for its Guardian thin-film encapsulation system from a major Japanese customer.
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, has announced the grand opening of a second 371,000 square ft manufacturing facility in Shanghai, China.
SanDisk Corporation, have outlined plans currently being worked out with its long-standing manufacturing partner Toshiba for the construction and ramp of a new 300mm facility, dubbed Fab 5, for NAND flash production.
The Bosch Group has celebrated the completion of its new headquarters and expansion of its Technical Centre in Yongin, Gyeonggi with government officials, customers, other business partners and associates.
Foundry, Semiconductor Manufacturing International Corporation (SMIC) and Magma Design Automation Incorporated, a provider of semiconductor design software, have jointly announced the availability of an enhanced low-power IC implementation reference flow for SMIC's 90-nanometer (nm) process featuring Magma's Blast Power, Blast Fusion, and Blast Create.
The pressure for shorter times to market is pushing electronic equipment manufacturers to look beyond their trusted supply chain for quick delivery of components which are difficult to source. This has led to the growth of component counterfeiting. A recent report estimated the losses to customers falling victims of counterfeiters exceeded US$15 billion per annum.
It has been reported that amid some major changes taking place at the 45-nm node and beyond, Axcelis Technologies Inc. has decided to cease future product development in the rapid thermal processing (RTP) tool arena.
STMicroelectronics has introduced its new automotive-grade application processor with embedded GPS for navigation and telematics. The Cartesio processor perfectly couples with ST's GPS RF chip (STA5620), creating a unique offering that significantly reduces the form factor and bill-of-materials with no compromise in performance.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced the successful installation of its fourth IQ Aligner System for packaging applications at a major semiconductor manufacturing facility in Austria.