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Thursday 24th July 2003
Cree has purchased a portfolio of patents and patent applications relating to silicon carbide (SiC) technology from Scandinavian company ABB Research. The technology covered by the patents ranges from epitaxial growth to device and circuit-level technology.
Thursday 24th July 2003
IC Insights Top Ten IC company rankings for H2 2003 contain three from Europe, three from Japan, two from the USA, one from Korea and one from Taiwan. The market researcher comments that this is the first time that there are more European than US companies in the list.
Thursday 24th July 2003
BASF Venture Capital is investing in Scottish microdisplay company MicroEmissive Displays (MED). BASF Venture Capital and other venture capital providers including 3i will supply a total of $7.5mn in a first closing of a Series C round. Scottish Equity Partners will act as lead investor.
Thursday 24th July 2003
IC Insights Top Ten IC company rankings for H2 2003 contain three from Europe, three from Japan, two from the USA, one from Korea and one from Taiwan. The market researcher comments that this is the first time that there are more European than US companies in the list.
Tuesday 22nd July 2003
IMEC looks to strained silicon and germanium on insulator IMEC has launched two industrial affiliation programmes (IIAPs) targeting sub-45nm processes. The first programme aims at improving device performance by implementing strained silicon (Si) in the transistor channel for scaled planar MOS devices. The second will exploit the high-mobility features of germanium (Ge) to fabricate high-performance CMOS transistors. The programmes are inter-linked with IMEC's present advanced CMOS research programmes.
Tuesday 22nd July 2003
IMEC looks to strained silicon and germanium on insulator IMEC has launched two industrial affiliation programmes (IIAPs) targeting sub-45nm processes. The first programme aims at improving device performance by implementing strained silicon (Si) in the transistor channel for scaled planar MOS devices. The second will exploit the high-mobility features of germanium (Ge) to fabricate high-performance CMOS transistors. The programmes are inter-linked with IMEC's present advanced CMOS research programmes.
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Tuesday 22nd July 2003
Vorwerk Teppichwerke's carpet production plant in Hameln, Germany, has signed a co-operation agreement with Infineon Technologies concerning carpets with woven-in "intelligence". The two companies are joining forces on the development of a marketable solution and plan to present initial prototypes by the end of 2004.
Tuesday 22nd July 2003
Electroglas has sold its Design for Manufacturing (DFM) and Fab Solutions software product lines to FEI for $6mn in cash plus the assumption of certain liabilities. The product lines include Electroglas' Yield Manager and Merlin's Framework products.
Tuesday 22nd July 2003
Luxell Technologies and Cambridge Display Technology (CDT) are to collaborate in a programme to demonstrate the effectiveness of the Black Layer technology with CDT's Light Emitting Polymer (LEP) technology. Previously, the two companies fell out over a license agreement reached in Novermber 2001 (Bulletin 455, October 18, 2002).
Tuesday 22nd July 2003
Tuesday 22nd July 2003
Vorwerk Teppichwerke's carpet production plant in Hameln, Germany, has signed a co-operation agreement with Infineon Technologies concerning carpets with woven-in "intelligence". The two companies are joining forces on the development of a marketable solution and plan to present initial prototypes by the end of 2004.
Friday 18th July 2003
Carl Zeiss SMT claims to have produced the first commercial illumination system in the world for extreme ultraviolet (EUV) lithography.
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Friday 18th July 2003
Researchers at the Sandia US National Laboratory are claiming a first with their creation of solid-state white lighting on the basis of semiconductor quantum dots. Blue light devices have also been produced.
Friday 18th July 2003
Sandia researchers have produced a microfluidics device that can adsorb proteins from solution, hold them with negligible denaturation and release them on command (Science, July 18, 2003).
Friday 18th July 2003
Micronic Laser Systems and ASML have signed a memorandum of understanding to form a joint venture that will focus on the optical maskless lithography market for semiconductor manufacturing. The goal will be to develop an optical maskless lithography system by combining the semiconductor lithography technology of ASML with the mask pattern generator technology of Micronic based on its Spatial Light Modulator.
Friday 18th July 2003
EMCORE claims that it will dramatically improve the economics of producing GaN materials through its GaN RealTemp 200 tool. Gallium nitride materials are used in the production of blue, green, and UV LEDs for use in cell phones and other backlighting applications.
Thursday 17th July 2003
TEL has released a new wafer prober for research and development applications in vacuum environments. Temporarily named the VP-6, the new system is specifically designed for MEMS (micro electrical mechanical systems) and other devices for which high vacuum wafer testing is required.
Thursday 17th July 2003
Atlantic Technology in the UK and Smartest in Germany have formed a new joint venture to provide a broader range of test and assembly services in Europe. The joint venture will be called Briowave.
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Wednesday 16th July 2003
CLICK HERE For DoveBid's Calendar of Events. July auctions: Lumenon Innovative Lightwave Technology, Inc.; Mitsubishi Display Devices America, Inc.; Agilent Technologies; AMD. August auctions: SEMEX-17 Semicon Exchange, OPTEK Technology, Inc. Bid online at www.dovebid.com or at the auction site!
Wednesday 16th July 2003
Professor Deborah Chung and graduate student Chia-Ken Leong of the University at Buffalo (part of SUNY) have been studying the use of carbon black dispersion in an organic vehicle as potential thermal pastes for heatsink interfaces (to appear in Carbon, an international journal sponsored by the American Carbon Society).
Wednesday 16th July 2003
ASML is further reducing staff. In addition to its previously announced work force goal of employing 5200 people in continuing operations by July 2003, the company now intends to cut an extra 550 jobs globally.
Wednesday 16th July 2003
Vorwerk Teppichwerke’s carpet production plant in Hameln, Germany, has signed a co-operation agreement with Infineon Technologies concerning carpets with woven-in "intelligence". The two companies are joining forces on the development of a marketable solution and plan to present initial prototypes by the end of 2004.
Wednesday 16th July 2003
ATMI and Air Liquide announced an alliance to promote the productivity and safety benefits of SAGE gas packaging to the semiconductor industry.
Tuesday 15th July 2003
Soitec and ASM International claim a major milestone in their strained silicon-on-insulator (SOI) partnership programme with samples of a first-generation strained silicon wafer for the 65nm technology node. Work started in May 2003.

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