Worldwide silicon wafer area shipments increased by 20 percent in 2006 when compared to 2005 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.
Applied Materials, Inc. has announced its intention to cease future development of beamline implant products for semiconductor manufacturing and close the operations of its Applied Implant Technologies group.
Sharp Corp. in the fourth quarter of 2006 was toppled from the top spot in the global LCD-TV market, falling to fourth place, down from first in the third quarter, according to a new market share ranking from iSuppli Corp.
Intel Corporation researchers have developed a programmable processor that delivers supercomputer-like performance from a single, 80-core chip not much larger than the size of a finger nail while using less electricity than most of today's home appliances.
With record 2006 sales and a continuing momentum of design wins in January, Tevet Process Control Technologies has established its presence within the highly competitive semiconductor metrology market.
NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation, Sharp Corporation, and Sony Ericsson Mobile Communications, have announced that they plan to jointly develop a next-generation mobile phone platform1 for dual-mode handsets supporting HSDPA2/W-CDMA (3G) and GSM/GPRS/EDGE (2G). Development of the platform is targeted to complete during 2008.
Corning Incorporated announced that its board of directors has approved a capital expenditure plan of $160 million to further expand its capacity to manufacture large size glass substrates for active matrix liquid crystal displays (LCD) at its facility in Shizuoka, Japan.