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Wednesday 8th February 2006
THE ISSCC (International solid-state Circuits Conference (ISSCC) was the event where IMEC nanotechnology R&D center elected to announce three major advances in technologies that will be used in wireless autonomous sensor nodes..
Tuesday 7th February 2006
NEC Electronics Corporation, Sony Corporation, and Toshiba Corporation announce the agreement to jointly develop system LSI process technologies for the 45-nanometer (nm) generation.
Monday 6th February 2006
Freescale and STMicroelectronics are teaming up to establish a wide-ranging initiative to reinforce their respective strengths in automotive applications.
Sunday 5th February 2006
The Pacific Research Institute (PRI), in California, has challenged the conclusions reached by a recent report released by the Woodrow Wilson International Center that claims that U.S. laws and regulations cannot adequately protect the public against the risks of nanotechnology.
Saturday 4th February 2006
DURHAM, N.C. – A component of many proteins has been found to constitute one of the most powerful and resilient molecular "springs" in nature, researchers have discovered.
Thursday 2nd February 2006
The International SEMATECH Manufacturing Initiative (ISMI) has begun a program to explore critical issues and barriers to introduce a new wafer size for manufacturing in the semiconductor industry, consortium officials said.
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Thursday 2nd February 2006
Infineon Technologies AG has produced first sample chips in its advanced 65nm low-power and high-performance CMOS platform technology.
Thursday 2nd February 2006
PONTIS Venture Partners and Truffle Venture invested in RF-iT Solutions, a Spin-off from the semiconductor group Infineon.
Wednesday 1st February 2006
Applied Materials faces a $100 million antitrust lawsuit, the allegations made by five U.S. chip manufacturing refurbishment companies are in dispute of anti-competitive practices.
Wednesday 1st February 2006
Elpida Memory, Inc. (Elpida) announced it has reached an agreement with the United States Department of Justice - Antitrust Division - (DOJ) to plead guilty to certain violations of US antitrust laws.
Wednesday 1st February 2006
Texas Instruments (TI) Incorporated announced it has finalised its acquisition of Chipcon, a leading company in the design of short-range, low-power wireless RF (radio frequency) transceiver devices.
Tuesday 31st January 2006
Rambus Inc announced that Udo Muerle has been named Director of Business Development for its new European office Mr Muerle is responsible for the overall management and direction of Rambus’ strategic customer and partnership relationships in Europe.
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Monday 30th January 2006
India Semiconductor Association (ISA), premier representative body of the semiconductor industry in India and Frost & Sullivan, global growth consulting company, announced the launch of its first comprehensive market research reports on the Indian semiconductor industry.
Sunday 29th January 2006
sp3 Inc., supplier of diamond film products, equipment and services, announced a major capital investment from existing partner Seki Technotron Corporation, Japanese sales and marketing company specialising in high technology industries.
Saturday 28th January 2006
Nordic Semiconductor ASA and Nu Horizons Electronics Corporation announced a North American extension of their existing pan-Asian distribution agreement that was agreed in October 2005.
Saturday 28th January 2006
STMicroelectronics announced the appointment of Jeffrey See as Corporate Vice President and General Manager of ST’s worldwide back-end operations.
Friday 27th January 2006
Novellus Systems, Inc announced Andrew Goh, president of its Southeast Asia operations.
Friday 27th January 2006
Paul Springthorpe has joined Ionpure Technologies as European Technical Manager. He takes responsibility for all areas of technical support and training for Ionpure electro deionisation (EDI)-based products throughout Europe.
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Friday 27th January 2006
Tessera Technologies Inc has taken the decision to strengthen its legal defence system by filing a patent law suit against five top integrated circuit manufacturers.
Thursday 26th January 2006
Intel Corporation announced it has reached an important milestone in the development of 45 nanometer (nm) logic technology. Intel has produced what are believed to be the first fully functional SRAM (Static Random Access Memory) chips using 45nm process technology, its next– generation, high–volume semiconductor manufacturing process.
Thursday 26th January 2006
ApNano Materials, Inc, announced that the European Union Commission has approved a grant of ¤11.6 million to develop new composite coatings and lubricants based on ApNano Materials' nanoparticles – the inorganic fullerenes (IF) – which have unique friction and wear reducing properties.
Thursday 26th January 2006
The global market for MEMS devices and production equipment was worth an estimated $5 billion in 2005. Forecasts predict an increase to $12.5 billion through 2010, an average annual growth rate (AAGR) of more than 20% According to the technical market research report, RGB-270R MEMS: A Roadmap to Technologies and Applications from Business Communications Co., Inc.
Thursday 26th January 2006
Cathode ray tubing has been a standard of display technology for many years. As display technology becomes more progressive, these displays are gradually being replaced with models that are more compact and consume less power. As displays become more and more advanced there are fewer reasons to continue to invest in cathode ray tube (CRT) displays.
Thursday 26th January 2006
DEK has set out a vision for the future that demands wafer level accuracy, six-sigma repeatability and first time print as fundamental capabilities for next generation screen printing in SMT and semiconductor assembly.

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