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Thursday 6th December 2018
New automatic grinder is suited to silicon, LiTaO3, LiNbO3, and SiC wafers
Tuesday 4th December 2018
New BONDSCALE system set to provide a significant boost in wafer bond productivity; addresses logic transistor scaling and 3D integration challenges outlined in IRDS Roadmap
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Tuesday 20th November 2018
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Thursday 15th November 2018
Tuesday 13th November 2018
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Monday 12th November 2018
Siltectra's Cold Split technology will be used to double the number of chips per SiC wafer.
Friday 2nd November 2018
By Mark Firth is Technical Director of Ichor Systems

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