North American-based manufacturers of semiconductor equipment posted US$1.23 billion in orders in October 2007 (three month average basis) and a book-to-bill ratio of 0.83 according to the October 2007 Book-to-Bill Report published today by SEMI.
Varian Semiconductor Equipment Associates Incorporated has announced that its Board of Directors amended its stock repurchase programme by increasing the amount of funds that may be expended in repurchasing Varian Semiconductor's common stock from US$600,000,000 to US$700,000,000.
Rohm and Haas Electronic Materials, CMP Technologies, a leader and innovator in chemical mechanical planarisation technology for the global semiconductor industry, has announced that its newest plant in Hsinchu, Taiwan has achieved International Organisation for Standardisation (ISO) 9001:2000 status for the manufacture of CMP polishing pads.
Applied Materials Incorporated has announced an agreement to acquire Baccini, Italy, a supplier of automated metallisation and test systems for manufacturing crystalline silicon (c-Si) photovoltaic (PV) cells.
Nanotechnology is forecasted to be among the most significant technologies of the current century, and one of the important megatrends of this decade. Nanotechnology refers to a size scale of one billionth of a meter, and to the new physical phenomena the size scale reveals. It is currently being applied e.g. in sensors, diagnostics, materials and the memories of computers. In her PhD thesis, M Sc. (Econ.) Nina Granqvist studies the emergence of nanotechnology as a domain of public investment and business activity in Northern Europe and USA. She interviewed some 60 people and analyzed over 200 publications for her research.
The Semiconductor Industry Association (SIA), San Jose, has announced that it is forecasting solid growth over the next two years, with a compounded annual growth rate (CAGR) of ~7.7%, resulting in a US$321B market by 2010.
Tower Semiconductor Limited, an independent specialty foundry, has announced the opening of a representative office in Taiwan to support its increasing presence throughout the Asia Pacific region. Tower's new office will be located in Hsinchu and will serve existing and future regional customers.
One year after inaugurating its fourth manufacturing facilities in Wykroty, Poland, HMS has completed its fifth factory in Lodz, Poland, HMS Lodz II. With approximately 2.500 m² of office and manufacturing space the facilities will take up production on 15 December 2007. The HMS property allows for a total expansion of a further 20.000 m² in the future.
XinAo Group, a company with an energy and engineering-related history of over ten years, has become the latest new entrant to the solar market with plans to build a 500MW thin film large substrate plant in China, employing Applied Materials' turnkey ‘SunFab' equipment production line. A contract was signed on 13 November, 2007.
AIXTRON AG has announced the order of a novel pilot manufacturing system specialised for OLED lighting and organic photovoltaic products from the Fraunhofer Institute for Photonic Microsystems (IPMS) in Dresden, Germany.
Infineon Technologies, a supplier of semiconductor and system solutions, and Advanced Semiconductor Engineering Incorporated (ASE), a semiconductor packaging and test company, have announced a partnership to introduce semiconductor packages with a higher integration level of package size with an almost infinite number of contact elements.
Greenlight Energy Resources, an operator of renewable energy projects and an investor in early stage renewable energy companies, Avista Corporation, and several other investors have put US$10 million in Series A funding in GreenVolts, a leader in high concentrating photovoltaic technology and wholesale distributed energy.
S.E.T. (former SUSS MicroTec Device Bonder Division), a supplier of high accuracy die-to-die, die-to-wafer bonding and nanoimprint lithography solutions has announced that the partnership between S.E.T. and CEA Leti has resulted in a radically new generation high accuracy (0.5 µm), high force (4,000 N) device bonder for wafer diameters up to 300 mm. It includes a built-in chamber for collective reflow in a gas or vacuum environment. The system also features nanoimprinting capabilities.
Aquest Systems, a developer of innovative automation solutions for the global semiconductor industry, has announced the availability of its new FabEX ;No-Wait-ProductivitySM Improvement (NPI) solution.
It has been reported PC microprocessor shipments worldwide grew 14.3% sequentially to reach record levels in the third calendar quarter of 2007 (3Q07), according to IDC researchers. Consequently, worldwide PC microprocessor revenue rose 14.8% to US$7.95 billion in the quarter.
Chipmaker, ON Semiconductor Corporation, has announced that it has signed an agreement to acquire voltage regulation and thermal monitoring products for computing applications from Analog Devices Incorporated (ADI).
According to Jin Seog Choi, chief technology officer at Hynix Semiconductor Incorporated, Korea, Lithography is among the top productivity challenges facing the semiconductor industry, but packaging and testing costs are another area that must be addressed
Nanometrics Incorporated, a supplier of advanced metrology equipment to the semiconductor industry, has announced that AIXTRON AG, a provider of deposition tools used in the worldwide production of advanced components for electronic and opto-electronic applications, has purchased the Nanometrics VerteX photoluminescence (PL) mapping system to determine material composition, measure layer thickness and improve the wafer uniformity performance of its equipment.