The Pacific Research Institute (PRI), in California, has challenged the conclusions reached by a recent report released by the Woodrow Wilson International Center that claims that U.S. laws and regulations cannot adequately protect the public against the risks of nanotechnology.
The International SEMATECH Manufacturing Initiative (ISMI) has begun a program to explore critical issues and barriers to introduce a new wafer size for manufacturing in the semiconductor industry, consortium officials said.
Rambus Inc announced that Udo Muerle has been named Director of Business Development for its new European office Mr Muerle is responsible for the overall management and direction of Rambus’ strategic customer and partnership relationships in Europe.
India Semiconductor Association (ISA), premier representative body of the semiconductor industry in India and Frost & Sullivan, global growth consulting company, announced the launch of its first comprehensive market research reports on the Indian semiconductor industry.
sp3 Inc., supplier of diamond film products, equipment and services, announced a major capital investment from existing partner Seki Technotron Corporation, Japanese sales and marketing company specialising in high technology industries.
Paul Springthorpe has joined Ionpure Technologies as European Technical Manager. He takes responsibility for all areas of technical support and training for Ionpure electro deionisation (EDI)-based products throughout Europe.
Intel Corporation announced it has reached an important milestone in the development of 45 nanometer (nm) logic technology. Intel has produced what are believed to be the first fully functional SRAM (Static Random Access Memory) chips using 45nm process technology, its next– generation, high–volume semiconductor manufacturing process.
ApNano Materials, Inc, announced that the European Union Commission has approved a grant of ¤11.6 million to develop new composite coatings and lubricants based on ApNano Materials' nanoparticles – the inorganic fullerenes (IF) – which have unique friction and wear reducing properties.
The global market for MEMS devices and production equipment was worth an estimated $5 billion in 2005. Forecasts predict an increase to $12.5 billion through 2010, an average annual growth rate (AAGR) of more than 20% According to the technical market research report, RGB-270R MEMS: A Roadmap to Technologies and Applications from Business Communications Co., Inc.
Cathode ray tubing has been a standard of display technology for many years. As display technology becomes more progressive, these displays are gradually being replaced with models that are more compact and consume less power. As displays become more and more advanced there are fewer reasons to continue to invest in cathode ray tube (CRT) displays.
DEK has set out a vision for the future that demands wafer level accuracy, six-sigma repeatability and first time print as fundamental capabilities for next generation screen printing in SMT and semiconductor assembly.
Applied Materials, Inc. and IMEC have announced a significant joint effort to develop 32nm and 22nm-node copper/low k interconnect processing technologies using a suite of Applied Materials' most advanced systems. The goal of the joint program is to address critical manufacturing challenges that chipmakers may face as they make the transition to future device generations, helping them to bring new products to market more rapidly while minimising risk
IBM, Sony Corporation and Toshiba have announced the commencement of a new, five-year phase of their joint technology development alliance. As part of this broad semiconductor research and development collaboration, the three companies will work together on fundamental research, related to advanced process technologies at 32 nanometers and beyond. The agreement will help enable the three companies to more rapidly investigate, identify and commercialise new technologies for consumer and other applications.