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Monday 2nd February 2009
Room temperature bonding process available for foundries, OEMs, IDMs, OSATs
Monday 2nd February 2009
Arnaud de Weert joins Infineon supervisory board
Monday 2nd February 2009
SUSS MicroTec AG: Frank Averdung Assumes Position of Chief Executive Officer Ahead of Schedule
Thursday 29th January 2009
Commission authorises aid of €457 million to France for Nano2012 R&D programme
Wednesday 28th January 2009
IQE announce strong trading performance in 2008 despite global economic crisis. The company has realigned its cost base to protect margins in 2009
Wednesday 28th January 2009
ILS Technology Partners with Florida Atlantic University on Industry Standards Initiative
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Wednesday 28th January 2009
Synopsys expands collaboration with STMicroelectronics in timing sign-off. Companies collaborate to accelerate deployment of state of the art timing analysis technology for 45- and 32-nanometer process nodes
Wednesday 28th January 2009
Nanovea Profilometer Receives “Class 1”Cleanroom Approval
Wednesday 28th January 2009
Fraunhofer Institute Berlin selects Asymtek’s dispensing and coating technology to equip its research centre
Wednesday 28th January 2009
According to reports in the Japanese media the chip giant is planning to close some Japanese based manufacturing plants.
Wednesday 28th January 2009
According to a report from the India Semiconductor Association (ISA) and Frost and Sullivan (F&S) the Indian semiconductor industry will only grow half of previous predictions.
Wednesday 28th January 2009
ISMI opens new Environment, Safety & Health (ESH) technology centre to tackle green technology challenges.
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Monday 26th January 2009
In a further streamlining of portfolio and group structure, Oerlikon sells two of its semiconductor business units.
Friday 23rd January 2009
Munich court confirms the memory maker has filed for insolvency despite recent rescue packages.
Friday 23rd January 2009
Dr. Michael Jaffé appointed as preliminary insolvency administrator for Qimonda
Friday 23rd January 2009
MEMC reports at least 20% reduction in profit and sales.
Friday 23rd January 2009
A new type of semiconductor ink shows promising signs for printable and flexible electronics.
Friday 23rd January 2009
Ubiquisys and picoChip extend collaboration for next generation femtocells.
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Thursday 22nd January 2009
EV Group wins order from Samsung Electro-Mechanics
Thursday 22nd January 2009
Intel to consolidate manufacturing operations and will halt production at five older factories.
Thursday 22nd January 2009
TSMC expecting first loss since 1990
Wednesday 21st January 2009
China’s semiconductor market to fall 5.8 percent in 2009 says iSuppli.
Tuesday 20th January 2009
European semiconductor sales industry indicator drops after November fall.
Tuesday 20th January 2009
AIXTRON AG and Ovonyx partner to develop Deposition Technology for advanced Phase-Change Memory

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