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Wednesday 2nd May 2007
The Bosch Group plans to acquire Pharmatec, headquartered in Dresden, Germany, from Fresenius ProServe.
Wednesday 2nd May 2007
HP has announced that it is beginning to reap returns from its 10-year investment in nanoscale electronics with the licensing of technology that could enable the fabrication of semiconductor chips significantly more powerful than those available today.
Wednesday 2nd May 2007
Semiconductor metrology equipment manufacturer Jordan Valley Semiconductors has announced they have sold, installed and qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications.
Wednesday 2nd May 2007
ST Microelectronics has placed an order for an NIL R&D system to be used in their FTM / Advanced R&D – Post Silicon Technology (PST) unit for development purposes. Obducat has also produced stampers that are being used in this assessment project.
Wednesday 2nd May 2007
Over the past three years, there has been a sharp escalation in the development and marketing of edutainment toys aimed at toddlers, grade-school children, and more recently, at infants, reports In-Stat.
Wednesday 2nd May 2007
CVI is pleased to announce that an agreement has been signed with Barloworld Scientific to acquire Melles Griot.
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Tuesday 1st May 2007
Skire has announced Samsung Texas Construction, Inc. (STCI) has used its Unifier solution to meet stringent turnaround requirements for critical design and construction documents that are essential for on-time project completion.
Tuesday 1st May 2007
Owlstone Nanotech has announced that it has received purchase orders for three units of the Owlstone Tourist in the UK.
Tuesday 1st May 2007
Aviza Technology has announced it has received a multiple system order for its RVP-300plus thermal processing system from a leading foundry based in Taiwan.
Monday 30th April 2007
The March figures for semiconductor sales data have been better than expected. The European market did especially well with 4.8% increase on a year over year base and in comparison with the other regions.
Monday 30th April 2007
STMicroelectronics has reported positive results and continued productivity in the Serial EEPROM market for 2006 for the third successive year – according to
Monday 30th April 2007
Samsung Electronics has announced plans to begin mass producing 16 gigabit (Gb) NAND flash, the highest capacity memory chip now available. The company said it will fabricate the devices in 51 nanometres (nm), one of the finest process technology to be used in memory mass production to date.
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Monday 30th April 2007
In efforts that can improve studies of biological objects and the construction of nanotech materials, researchers at the University of California-Berkeley have invented "optoelectronic tweezers," a new way of controlling nanometre-scale objects.
Friday 27th April 2007
Corning Incorporated has announced that its Board of Directors has approved a $300 million facility improvement plan for the company's Sullivan Park Research and Development campus near Corning, N.Y.
Friday 27th April 2007
Despite a growing number of competitors, Applied materials and Rohm and Haas share huge leads in the CMP equipment and materials sectors, respectively, according to the report CMP Technology: Competition, Products, Markets, recently published by The Information Network.
Friday 27th April 2007
Hynix Semiconductor achieved the strongest performance of all DRAM suppliers in the first quarter, allowing it to come within striking distance of Samsung Electronics Co., according to iSuppli Corp.
Friday 27th April 2007
Shanghai semiconductor industry is undergoing an epoch of great success and is expected to continue the same trend.
Friday 27th April 2007
Carl Zeiss SMT and SII NanoTechnology (SIINT), a subsidiary of Seiko Instruments jointly celebrated the opening of the new Yokohama Nanotechnology Demonstration Centre.
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Friday 27th April 2007
During a general meeting of Imec's Board of directors it was confirmed that 2006 was an all round excellent year for Europe's independant research company.
Thursday 26th April 2007
Intel Corporation and Micron Technology have announced they are sampling industry-leading 50 nanometre (nm) multi-level cell (MLC) NAND flash memory manufactured by their NAND flash memory joint venture, IM Flash Technologies.
Thursday 26th April 2007
Qimonda has announced plans to strengthen its footprint in the Asian market by building its first fully-owned 300mm manufacturing facility on the continent.
Thursday 26th April 2007
SanDisk Corporation and Qimonda have entered into an agreement to jointly develop and manufacture MCPs utilizing SanDisk's NAND flash and controllers and Qimonda's low power mobile DRAM.
Thursday 26th April 2007
Corning Incorporated has announced that its board of directors has approved a capital expenditure plan of $129 million to further expand manufacturing capacity for large-size glass substrates for active matrix liquid crystal displays (LCD) at its Taichung, Taiwan manufacturing facility.
Thursday 26th April 2007
RF Micro Devices has announced the addition of a research and development (R&D) centre in the Company's Shanghai facility.

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