HP has announced that it is beginning to reap returns from its 10-year investment in nanoscale electronics with the licensing of technology that could enable the fabrication of semiconductor chips significantly more powerful than those available today.
Semiconductor metrology equipment manufacturer Jordan Valley Semiconductors has announced they have sold, installed and qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications.
ST Microelectronics has placed an order for an NIL R&D system to be used in their FTM / Advanced R&D – Post Silicon Technology (PST) unit for development purposes. Obducat has also produced stampers that are being used in this assessment project.
Over the past three years, there has been a sharp escalation in the development and marketing of edutainment toys aimed at toddlers, grade-school children, and more recently, at infants, reports In-Stat.
Skire has announced Samsung Texas Construction, Inc. (STCI) has used its Unifier solution to meet stringent turnaround requirements for critical design and construction documents that are essential for on-time project completion.
The March figures for semiconductor sales data have been better than expected. The European market did especially well with 4.8% increase on a year over year base and in comparison with the other regions.
Samsung Electronics has announced plans to begin mass producing 16 gigabit (Gb) NAND flash, the highest capacity memory chip now available. The company said it will fabricate the devices in 51 nanometres (nm), one of the finest process technology to be used in memory mass production to date.
In efforts that can improve studies of biological objects and the construction of nanotech materials, researchers at the University of California-Berkeley have invented "optoelectronic tweezers," a new way of controlling nanometre-scale objects.
Despite a growing number of competitors, Applied materials and Rohm and Haas share huge leads in the CMP equipment and materials sectors, respectively, according to the report CMP Technology: Competition, Products, Markets, recently published by The Information Network.
Intel Corporation and Micron Technology have announced they are sampling industry-leading 50 nanometre (nm) multi-level cell (MLC) NAND flash memory manufactured by their NAND flash memory joint venture, IM Flash Technologies.
Corning Incorporated has announced that its board of directors has approved a capital expenditure plan of $129 million to further expand manufacturing capacity for large-size glass substrates for active matrix liquid crystal displays (LCD) at its Taichung, Taiwan manufacturing facility.