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Monday 4th October 2004
Global private equity firm The Carlyle Group has completed the acquisition of AZ Electronic Materials for EUR338mn ($420mn) and appointed the management team and board.
Monday 4th October 2004
Automotive ASIC producer ELMOS Semiconductor has signed a multiple-system purchase agreement for Credence Systems' Piranha analogue and mixed-signal chip test system.
Monday 4th October 2004
German high power semiconductor producer eupec has issued its first complete product family complying with the European Union guidelines on Restriction of the Use of Certain Hazardous Substances (RoHS, 2002/95/EG) and Waste Electrical and Electronic Equipment (WEEE, 2002/96/EG).
Monday 4th October 2004
Renesas Technology claims that its 4Gbit assist gate AND (AG-AND) type Flash memory is the world's fastest.
Monday 4th October 2004
Dow Corning has signed a joint development contract with Scotland's Invint, a company specialising in conductive polymer interconnect technology.
Monday 4th October 2004
A new disk technology is under development that could store up to 1TeraBytes (1000GBytes).
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Monday 4th October 2004
The European Union (EU) Competitiveness Council has called for continuity between the Sixth and Seventh Framework programmes (FP6 and FP7), but with initiatives to simplify procedures.
Monday 4th October 2004
Nikon, ASML and Carl Zeiss SMT have agreed to a comprehensive settlement of legal proceedings and a cross-license of patents related to lithography equipment.
Monday 4th October 2004
ASML Holding (ASML) announced that it has seen its order backlog for lithography systems increase during Q3 2004 in units and value.
Tuesday 28th September 2004
Renesas Technology has announced that it has reached an agreement with STMicroelectronics to take over the SuperH CPU core licensing business of SuperH, Inc. (SHI), a joint venture company with ST.
Tuesday 28th September 2004
Dow Corning Corporation has signed a joint development contract with Scotland's Invint, a company specialising in conductive polymer interconnect technology.
Tuesday 28th September 2004
Meeting on 24 September, the EU Competitiveness Council adopted conclusions calling for continuity between the Sixth and Seventh Framework Programmes, but with initiatives to simplify procedures.
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Monday 27th September 2004
A new disk technology is under development that could store up to 1TeraBytes (1000GBytes). Researchers at Imperial College London, working closely with colleagues at the University of Neuchatel, Switzerland, and the Aristotle University of Thessaloniki, Greece, estimate that the "Multiplexed Optical Data Storage" (MODS) disks would cost approximately the same to manufacture as an ordinary DVD.
Monday 27th September 2004
Infineon Technologies and Volkswagen have jointly developed a "Basic Telematics Unit" platform for wireless telecoms and location-based information services in motor vehicles. The co-operation aimed to build a platform for the price of an existing in-car telephone unit bringing advanced information services out of the luxury car and into the mass market. Volkswagen and Infineon intend marketing the platform as a manufacturer-independent solution. Differentiation will be provided by application software, the functions offered and the user interface.
Friday 24th September 2004
German high power semiconductor producer eupec has issued its first complete product family complying with the European Union guidelines on Restriction of the Use of Certain Hazardous Substances (RoHS, 2002/95/EG) and Waste Electrical and Electronic Equipment (WEEE, 2002/96/EG).
Friday 24th September 2004
Infineon Technologies has reached an agreement with the Antitrust division of the US Department of Justice (DoJ).
Friday 24th September 2004
Hynix Semiconductor has been fined KRW2bn for accounting fraud. The company's former chief executive, Park Chong-Sup has been reported to prosecutors for further investigation.
Friday 24th September 2004
STMicroelectronics has announced that its Kirkop back-end semiconductor manufacturing facility in Malta has taken the initiative to use only biodiesel fuel for the diesel-powered vehicles in its transport fleet and for its boiler systems.
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Friday 24th September 2004
Infineon has announced the formal opening of a new memory chip packaging facility in China.
Friday 24th September 2004
AMD today announced plans for the formation of a Greater China headquarters in Beijing.
Friday 24th September 2004
Photronics and SIGMA-C plan to combine their respective technologies to strengthen Photronics' Integrated Lithography Plane (ILP) initiative.
Friday 24th September 2004
Isonics reports on-schedule completion of the consolidation of its wafer manufacturing operations into its new Fab 2 facility, in Vancouver, Washington state.
Friday 24th September 2004
Hynix plans to double its expenditure to KRW1.80tr ($1.57bn) to enable facility upgrades.
Friday 24th September 2004
VLSI Research saw the world semiconductor equipment book-to-bill ratio fall below 1.00 for the first time in a year.

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