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Friday 24th September 2004
Photronics and SIGMA-C plan to combine their respective technologies to strengthen Photronics' Integrated Lithography Plane (ILP) initiative.
Friday 24th September 2004
Isonics reports on-schedule completion of the consolidation of its wafer manufacturing operations into its new Fab 2 facility, in Vancouver, Washington state.
Friday 24th September 2004
Hynix plans to double its expenditure to KRW1.80tr ($1.57bn) to enable facility upgrades.
Friday 24th September 2004
VLSI Research saw the world semiconductor equipment book-to-bill ratio fall below 1.00 for the first time in a year.
Friday 24th September 2004
Philips Electronics has announced that effective January 1, 2005, Scott McGregor will, at his own request, relinquish his position as CEO of the Semiconductors division and leave the company to return to the USA.
Friday 24th September 2004
Ricoh will use UMC's L90 Standard Performance (SP) process device option with low-k dielectrics for next generation ASIC and image processor product lines.
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Friday 24th September 2004
MKS Instruments announced that sales for its Q3 ending September 30, 2004, are expected to be below previous guidance for flat sequential growth due to lower than anticipated orders from the semiconductor capital equipment market along with some stretched out delivery requests and order push outs.
Friday 24th September 2004
Samsung Electronics claims the industry's first 60nm 8Gbit NAND Flash memory device data storage for low-density mobile hard disks in mobile appliances.
Friday 24th September 2004
Agere Systems says that its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging.
Friday 24th September 2004
The Fraunhofer Institute for Silicon Technology (ISIT), Siemens and Infineon announced proposed development of electronic biochip technology along with their nomination for the German Federal President's Deutscher Zukunftspreis technology and innovation award for work already carried out.
Friday 24th September 2004
UK company Applied Microengineering (AML) gave details of its planned use for its recent UK government Department of Trade and Industry (DTI) grant of GBP678,000 to the LOBEL project that will develop a new nano device production tool for micro polymer embossing and nano-imprint lithography (NIL) and surface activation for low-temperature wafer bonding (Bulletin 551, September 15, 2004).
Friday 24th September 2004
Samsung Electronics has developed a 2Mpixel CMOS image sensor (CIS) chip, claiming an industry first with the use of 0.13micron process technology.
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Friday 24th September 2004
Infineon Technologies has licensed Axon Technologies' Programmable Metallization Cell (PMC) non-volatile memory technology.
Thursday 23rd September 2004
Novellus Systems Inc. has announced that its board of directors has approved an increase to Novellus' previously authorized stock repurchase program. The terms of the expanded program will permit Novellus to repurchase up to an aggregate of approximately $1.1 billion of its outstanding common stock through September 14, 2009. This represents an increase of $1 billion to the approximately $100 million remaining under the previously authorized program.
Thursday 23rd September 2004
Asyst Technologies has announced today that it will team with IBM Global Services to provide a full range of manufacturing automation solutions for the worldwide semiconductor marketplace. The agreement will provide Asyst with a worldwide integration service that will enable them to enhance current technology and have a foot in the door for future growth in new industries.
Thursday 23rd September 2004
UK company Applied Microengineering (AML) gave details of its planned use for its recent UK government DTI grant of GBP678,000 to the LOBEL project that will develop a new nano device production tool for micro polymer embossing and nano-imprint lithography (NIL) and surface activation for low-temperature wafer bonding (Bulletin 551, September 15, 2004).
Thursday 23rd September 2004
Philips Electronics has announced that effective January 1, 2005, Scott McGregor will, at his own request, relinquish his position as CEO of the Semiconductors division and leave the company to return to the USA. McGregor has been in his current position since September 1, 2001.
Thursday 23rd September 2004
STMicroelectronics has announced that its Kirkop back-end semiconductor manufacturing facility in Malta has taken the initiative to use only biodiesel fuel for the diesel-powered vehicles in its transport fleet and for its boiler systems.
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Thursday 23rd September 2004
Infineon has announced the formal opening of a new memory chip packaging facility in China. Infineon Technologies Suzhou was opened in the presence of the Suzhou Party Secretary Wang Min. Work on constructing the new production facility has begun in October 2003, and volume production is planned to commence in early 2005. Once completed, the facility will have a maximum capacity of up to 1bn memory chips a year.
Thursday 23rd September 2004
Infineon Technologies has licensed Axon Technologies’ Programmable Metallization Cell (PMC) non-volatile memory technology. Infineon follows Micron Technology as the second major memory manufacturer to obtain a non-exclusive license for the memory and switching technology.
Tuesday 21st September 2004
According to a number of news reports from Asia, South Korea's Supreme Public Prosecutor's Office have announced they are investigating an accounting fraud of almost 2 trillion won ($1.7 billion) at Hynix Semiconductor that began in 1996 and ended in 1999. According to the reports the Prosecutor's Office said it was looking into whether funds were illegally diverted from the company's books to Hyundai affiliates.
Monday 20th September 2004
Agere Systems have announced from its UK office that its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging. The company's states that research found a tin-nickel combination in semiconductor packaging mitigates "tin whisker" problem and improves long-term reliability of lead-free devices. To solve the problem, Agere added a layer of nickel between the layers of tin and copper and discovered that tin whisker growth was mitigated in that scenario.
Monday 20th September 2004
Asyst Technologies has announced today that it will team with IBM Global Services to provide a full range of manufacturing automation solutions for the worldwide semiconductor marketplace. The agreement will provide Asyst with a worldwide integration service that will enable them to enhance current technology and have a foot in the door for future growth in new industries.
Thursday 16th September 2004
Photronics and SIGMA-C plan to combine their respective technologies to strengthen Photronics' Integrated Lithography Plane (ILP) initiative. Photronics' aim is to provide design and mask integration support to semiconductor companies transitioning to the 65nm and 45nm technology nodes.

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