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Tuesday 21st February 2006
Freescale and STMicroelectronics, are teaming up to establish a wide-ranging initiative to reinforce their respective strengths in automotive applications.
Tuesday 21st February 2006
SUSS MicroTec, supplier of precision manufacturing equipment for the semiconductor and emerging markets, announced the installation of an additional wafer bonding system at Innovative Micro Technology.
Tuesday 21st February 2006
JSR Corporation of Tokyo, and its US operations, JSR Micro, Inc., announced that it has, through a long-standing partnership with IBM, further advanced the viability of immersion lithography by successfully demonstrating sub-30nm patterning.
Tuesday 21st February 2006
Freescale and STMicroelectronics, are teaming up to establish a wide-ranging initiative to reinforce their respective strengths in automotive applications. The two companies will create a joint microcontroller design team, align process technologies and share intellectual property, including high-power MOS technologies
Monday 20th February 2006
UK Trade & Investment will be leading a delegation of pioneering UK nanotechnology organisations at the flagship nano tech 2006 event, taking place in Tokyo next week.
Monday 20th February 2006
Freescale Semiconductor is simplifying product development for embedded networking and graphical user interface (GUI) systems with a suite of open source development tools for its MCF532x and MCF537x ColdFire device families.
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Monday 20th February 2006
SUSS MicroTec, supplier of precision manufacturing equipment for the semiconductor and emerging markets, announced the installation of an additional wafer bonding system at Innovative Micro Technology.
Sunday 19th February 2006
KLA-Tencor unveiled its next-generation photomask inspection system, STARlight-2, providing wafer fabs with a cost-effective contamination inspection solution for all types of photomasks, including mainstream extreme resolution enhancement technique (XRET) photomasks, at the 65-nm node and below.
Sunday 19th February 2006
The Micromanipulator Company, is pleased to introduce our new 300mm WLR reliability probe station, the 2200-US12-V0.
Sunday 19th February 2006
JSR Corporation of Tokyo, and its US operations, JSR Micro, Inc., announced that it has, through a long-standing partnership with IBM, further advanced the viability of immersion lithography by successfully demonstrating sub-30nm patterning.
Saturday 18th February 2006
Semico’s IPI guide model of prediction holds good news for the forth coming semiconductor industry projection for 2006, indicated with a 17.3% annual revenue growth rate. It is anticipated that on a geographical scale momentum will be generated from a good end of year round up from 2005 figures.
Saturday 18th February 2006
Applied Materials, Inc. announced that it has shipped its 500th 300mm CMP (chemical mechanical planarization) system.
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Saturday 18th February 2006
UK Trade & Investment will be leading a delegation of pioneering UK nanotechnology organisations at the flagship nano tech 2006 event, taking place in Tokyo next week.
Friday 17th February 2006
Image Technology, supplier of 1X full-field photomasks, announced that it has acquired a Lasertec Large Area Mask (LAM) defect inspection tool to enhance their full production line for advanced 9-inch photomasks.
Friday 17th February 2006
mPhase Technologies Inc. announced the promotion of its lead nanotechnology researcher Victor Lifton, to the position of Chief Scientist, with a larger responsibility for the company's emphasis on "small" technology - including the company's "smart" nano-structured battery and ultra-sensitive uncooled magnetometer.
Friday 17th February 2006
Freescale Semiconductor is simplifying product development for embedded networking and graphical user interface (GUI) systems with a suite of open source development tools for its MCF532x and MCF537x ColdFire device families.
Thursday 16th February 2006
Scientists at Philips Research have created a fully functional 13.56 MHz RFID tag based entirely on plastic electronics.
Thursday 16th February 2006
SanDisk Corporation announced the United States International Trade Commission (ITC) has instituted an investigation in response to a complaint filed by SanDisk.
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Thursday 16th February 2006
Carl Zeiss SMT, semiconductor unit, has approached FEI Co. (FEIC) U.S.-based Technology Company with regards to buying the company out. However, it is uncertain as to whether the deal will go ahead.
Thursday 16th February 2006
KLA-Tencor unveiled its next-generation photomask inspection system, STARlight-2, providing wafer fabs with a cost-effective contamination inspection solution for all types of photomasks, including mainstream extreme resolution enhancement technique (XRET) photomasks, at the 65-nm node and below.
Wednesday 15th February 2006
Micron Technology, Inc. announced a company reorganisation, focused on furthering the success of its product diversification efforts, according to a report by Business Wire.
Wednesday 15th February 2006
The Micromanipulator Company, is pleased to introduce our new 300mm WLR reliability probe station, the 2200-US12-V0.
Tuesday 14th February 2006
Essensium NV, a Belgian fabless provider of SoC ASICs (system-on-chip application-specific integrated circuits), announced that it has secured a strategic partnership with Silterra, a leading semiconductor wafer foundry in Malaysia, through a €6 million private equity financing from Silterra’s parent company Khazanah Nasional.
Tuesday 14th February 2006
Semico's IPI guide model of prediction holds good news for the forth coming semiconductor industry projection for 2006, indicated with a 17.3% annual revenue growth rate.

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