NXP Semiconductors, formerly Philips Semiconductors, and Sony Corporation have signed a memorandum of understanding (MOU) to establish by mid-year 2007 a joint venture (JV) that will drive global adoption of contactless smart card applications in mobile phones.
A University of Utah physicist took a step toward developing a superfast computer based on quantum physics by showing it is feasible to read data stored in the form of the magnetic "spins" of phosphorus atoms.
Applied Ventures, LLC, the venture capital fund of Applied Materials, has announced that it has invested $3.0 million in Solaicx, a private manufacturer of single-crystal silicon wafers for the solar photovoltaic (PV) industry.
Fraunhofer USA, the American subsidiary of Germany's largest research and development organization, recently won four major awards amounting to $2.9 million from the Michigan Economic Development Corporation.
The Semiconductor Industry Association (SIA) has released its annual forecast of global semiconductor sales, projecting that the industry will continue to ride a strong wave of consumer demand for electronic products, driving sales to $321 billion in 2009.
OPTi Inc announced that it has filed a patent infringement lawsuit against Advanced Micro Devices, Inc. ("AMD") for infringement of three U.S. patents entitled "Predictive Snooping of Cache Memory for Master-Initiated Accesses".
KLA-Tencor Corporation announced that, as expected, because the Company has not yet completed the restatement of its financial statements required due to the retroactive pricing of certain stock options, the Company was unable to file its quarterly report on Form 10-Q for the fiscal quarter ended September 30, 2006 by the required filing date of November 14, 2006.
VeriSilicon, Ltd. and MoSys, Inc. announced the companies are partnering to further expand the adoption of MoSys' popular 1T-SRAM technology by providing VeriSilicon customers seamless access to the patented technology.
The US-Taiwan Business Council welcomes the comments by the Investment Commission of the Ministry of Economic Affairs (MOEA), indicating that Taiwan will finalize a plan by the end of 2006 that would allow its chipmakers to use 0.18-micron manufacturing technology in China.
HCL Technologies Ltd an R&D, IT services, and business process outsourcing firm, and Celestica Inc., an electronics manufacturing service announced that the two companies have entered into an agreement to form a joint venture to provide complete concept-to-manufacturing (C2M) solutions for original equipment manufacturers (OEMs).
ATDF is expanding availability of its 454AZ CoMPetitor test mask after a key supplier reported using it to develop a breakthrough process for low-impact chemical-mechanical planarization (CMP) of semiconductor wafers.
Tegal Corporation announced that its wholly-owned subsidiary, Sputtered Films Inc. (SFI) agreed to terms settling its trade secrets case against Sergey Mishin, Advanced Modular Sputtering (AMS), Agilent Technologies, Inc., Avago Technologies U.S., Inc., Avago Technologies Wireless (U.S.A) Manufacturing, Inc. and other defendants.