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Wednesday 30th April 2008
Taiwan Semiconductor Manufacturing Co. (TSMC), a contract chip maker, reported better than expected first quarter net profit as its margins improved.
Tuesday 29th April 2008
Intel and Cray collaborate to develop future supercomputing technologies
Tuesday 29th April 2008
Infineon strengthens its power activities by acquiring Primarion
Tuesday 29th April 2008
The company liaised with the South American government to open an IC design training centre to bolster the semiconductor industry in Brazil. Further three centres are planned.
Tuesday 29th April 2008
The aim is to build next generation Digital Communications Interface. China's Video Industry Association supports the creation of the DIVA consortium to promote standardisation of a new interface for interactive digital television and CE networking
Tuesday 29th April 2008
Dr. L.S. Ganesh of IIT Madras joins the Board of Directors at Anantara
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Tuesday 29th April 2008
The companies sign a licence agreement to develop a new nano imprinting technology. It will be called ‘Substrate Conformal Imprint Lithography’ (SCIL)
Monday 28th April 2008
Increases SPICE modelling accuracy and simulation performance for high performance chip designs
Monday 28th April 2008
Infiniscale brings innovative modelling technology to organic electronics industry
Monday 28th April 2008
IBM and Matheson Tri-Gas to collaborate on semiconductor manufacturing technology. Specialty gases supplied by Matheson Tri-Gas to enable semiconductor advances
Friday 25th April 2008
CEA-LETI launches European "MAGIC" programme on mask less lithography (ML2) technology with a goal of introducing the technology for 32nm by 2010
Friday 25th April 2008
iSuppli upgrades DRAM market rating to “Neutral”
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Friday 25th April 2008
Micro Materials describe fluid cell performance for NanoTestT nanomechanical characterisation system
Thursday 24th April 2008
SEMATECH’S litho forum shines a light on high stakes shift to next generation manufacturing
Thursday 24th April 2008
Qimonda and Elpida to form technology partnership. Alliance for joint development of 4F² DRAM cell
Thursday 24th April 2008
Rohm and Haas cuts cost of consumables for Tungsten CMP by 20 percent with new groove design to reduce slurry consumption
Thursday 24th April 2008
The European machine tool manufacturer develops and produces automation concepts in Fukushima
Wednesday 23rd April 2008
The company gains slightly in fourth quarter microprocessor market
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Wednesday 23rd April 2008
Estimates expect the chip design market to exceed the $7.37b mark by 2008.
Wednesday 23rd April 2008
The company said it would invest in Indian wireless and semiconductor start up firms.
Wednesday 23rd April 2008
Infineon to supply HSDPA platform for Samsung’s HEDGE mobile phone family
Wednesday 23rd April 2008
Storage leader to collaborate in establishing NAND flash standard interface
Tuesday 22nd April 2008
REC has entered into a significant long term agreement for supply of multi crystalline silicon wafers to an existing customer. Under the agreement, REC will deliver wafers until 2013 worth about NOK 2 billion.
Tuesday 22nd April 2008
The company prepares for disposal and deconsolidation of Qimonda, the investment is reclassified into “Assets Held for Sale“. Qimonda’s operations and balance sheet are unaffected by Infineon’s write down while remaining assets not impaired

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