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Weekly Newsletter
27th May 2021
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
TESCAN New Delayering Capability for Unattended, Automated Failure Analysis

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Top News
PICOSUN Sprinter demonstrates record-breaking batch film quality

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NEWSLETTER SPONSOR: Xenics



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ADDITIONAL NEWS

Luvata announces €34M investment in Finland hot extrusion line
Luvata in Pori, Finland announces a €34M investment in a new hot extrusion line and facility on its premises in the Pori Copp...

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Brewer Science Recognized as Certified B Corporation
Brewer Science, a global technology leader, has announced it is now a Certified B Corporation. As a B Corp, Brewer Science is co...

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Allegro’s new magnetic position sensor enables next-generation ADAS applications
Allegro MicroSystems, Inc, a global suppler of power and sensing solutions for motion...

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5G to spur growth of GaN & SiC semiconductor market by 2027
Rampant development and roll out of 5G technology around the globe will offer new growth prospects to GaN and SiC power semiconduc...

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Reno Launches Series of Integrated RF Power Systems At 7nm or Below
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for nanoscale semiconductor manu...

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Oxford Instruments starts construction of new facility
Company breaks ground at site of state-of-the-art 107,660 sq. ft manufacturing facility in Bristol, UK

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Ensuring the Reliability Through Non-Destructive Testing
Manufacturers of high-end semiconductor electronic products used in consumer, industrial, and military applications have long re...

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Xenics introduces DIONE S 640
Dione S 640 has been announced today as the new SWaP high performance uncooled long-wave infrared (LWIR) camera from Xenics. Xeni...

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Silicon ISSUE 1
Volume 2021
Silicon Semiconductor Magazine
Featuring: Acoustically imaging the most elusive defects; New playbook for process control; Exploring emerging applications for PICs; Plus more...
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