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Weekly Newsletter
20th January 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
Mycronic receives order for an SLX mask writer

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Top News
ClassOne Appoints industry veteran Ken Gibbons

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VIDEO

EMD Electronics. A business of Merck KGaA, Darmstadt, Germany.

Mark Andrews, Technical editor for Silicon Semiconductor, Power Electronics World and PIC Magazine is joined by Anand Nambiar, the global head of Semiconductor Materials at EMD Electronics, a business of Merck KGaA, Darmstadt, Germany. The discussion focuses on next generation electronics post recession & COVID.

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NEWSLETTER SPONSOR: CS International



CONNECTING THE CS INDUSTRY

Back in Brussels on 28th - 29th June 2022, CS International, will return for its eleventh year face-to-face!

With a pedigree stretching back more than a decade, CS International has firmly established itself as the leading conference covering all aspects of compound semiconductor device manufacturing.

At the next meeting, to be held in June 2022, presentations will cover five of the most important topics of our time: how to build faster, more frugal networks; what’s needed to drive the deployment of the microLED; how we will build a multi-billion dollar SiC industry; the opportunities for VCSELs and their surface-emitting cousins; and what are the best ways to exploit the glorious potential of GaN.

Throughout these five sessions, experts from our community will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; deliver an up-to-date overview of the status of the CS industry; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs.

Visit the website or info@csinternational.net for more details.



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ADDITIONAL NEWS

ERS electronic appoints Mark Wachter as Chief Financial Officer
ERS electronic, in the market of thermal management solutions for semiconductor manufacturing, announces the appointment of Mark...

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Are you facing decisions and challenges with interconnects, pattern transfer, 3D scaling and atomic scale processing and integration?
Integrated materials solutions could be the answer.Merck KGaA, Darmstadt, Germany re...

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3D-Micromac AG appoints Hartmut Schubert to Chief Technology Officer
Hartmut Schubert, Chief Technology Officer

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Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
Companies hope to strengthen customer relationships with their combination of vacuum and thin-film deposition technology

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Brewer Science’s newly launched smart devices will be displayed at CES
Brewer Science will be presenting select items from its Smart Devices and Printed Ele...

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Imec demonstrates significant performance gains utilizing backside 3D SOC interconnects
Principal researchers at imec, working with Cadence EDA programmers, have demons...

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Siemens collaborates with PDF Solutions to boost IC yield and speed time
Siemens Digital Industries Software has announced a new collaboration with PDF Soluti...

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SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
SiLC Technologies (SiLC) has announced the launch of its powerful, compact vision sensor delivering coherent vision and chip-scale...

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Silicon ISSUE 5
Volume 42
Silicon Semiconductor Magazine
Featuring: ALD KEY TO MAXIMIZING CHIP YIELDS; LITHOGRAPHY CAN BOOST FOPLP YIELD; THE TWO REALMS OF ACOUSTIC MICRO IMAGING Plus more...
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