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Weekly Newsletter
28th April 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
Imec Ramps Up Development of High-NA EUV Patterning Ecosystem

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Top News
X-FAB Announces Upgrade to its Substrate Coupling Analysis Tool

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VIDEO

PerkinElmer Interview

Richard Stevenson, Technical Editor of Silicon Semiconductor Magazine speaks Chady Stephan from PerkinElmer about the use and detection of sulfuric acid in chip production.

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ADDITIONAL NEWS

Applied Materials Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors
Applied Materials, has introduced innovations that help customers continue 2D scaling...

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ASML bring e-beam inspection into volume manufacturing
ASML has announced the first customer installation of its HMI eScan 1100, the first multiple e-beam (multibeam) wafer inspection s...

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ClassOne Equipment Introduces New Takano Particle Inspection Systems
ClassOne Equipment, has introduced two new high-performance Takano particle inspection systems for ≤200mm and ≤300mm unpattern...

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Imec and Bühler enable high-throughput manufacturing of filter-on-chip CMOS sensors
Bühler Group’s Leybold Optics Business Area, a supplier of cutting-edge thin-film ...

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Brewer Science Earns Intel’s 2022 EPIC Distinguished Supplier Award
Brewer Science has announced that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to excellence,...

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ClassOne ships Solstice tool to microLED startup Raxium
Solstice plating system to help ramp high-volume production of ultra-bright microDisplays

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Advantest Donates ¥90 Million to Ukraine Crisis Relief Efforts
Semiconductor test equipment supplier Advantest Corporation has announced cash donations totaling ¥90 million to crisis relief ef...

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Xenics introduces Ceres V
Ceres V 640 and Ceres V 1280 have been announced today as the new high-performance offer for long-wave infrared (LWIR) cameras f...

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Silicon ISSUE 1
Volume 2022
Silicon Semiconductor Magazine
Featuring: Imec demonstrates significant performance gains utilizing backside 3D SOC interconnects; Sub-fab seals critical in handling complex chemistries at higher temperatures;Top semiconductor manufacturers improve design flow through IP management;Pandemic lessons learned will shape IC manufacturing well beyond 2022; Plus more...
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