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Weekly Newsletter
12th May 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
Electronics Supply Chain Challenges Are Getting Worse

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Top News
Advantest Rolls Out ACS Adaptive Probe Cleaning

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VIDEO

PerkinElmer Interview

Richard Stevenson, Technical Editor of Silicon Semiconductor Magazine speaks Chady Stephan from PerkinElmer about the use and detection of sulfuric acid in chip production.

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ADDITIONAL NEWS

Infineon revenue up in Q2 FY 2022
Infineon Technologies AG is reporting results for the second quarter of its 2022 fiscal year (period ended 31 March 2022). Q2 FY ...

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Teradyne Marks 7,000th J750 Semiconductor Test System Shipment
Teradyne, a supplier of automated test equipment, has announced the shipment of the 7,000th unit of its industry-leading J750 semi...

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2D Experimental Pilot Line offers developers the chance to test graphene-based sensors
The 2D Experimental Pilot Line (2D-EPL), a project grown from the Graphene Flagship, ...

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SEMI Report: Silicon Wafer Shipments Edge to New Record in Q1 2022
Worldwide silicon wafer area shipments in the first quarter of 2022 surpassed the previous record high set in the third quarter of...

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Atotech and Schweitzer Engineering Laboratories announce business partnership
Atotech, a specialty chemicals technology company and a market leader in advanced e...

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“Onshoring” chip production is a red herring for UK
Imagination Technologies and Global Counsel have published a new research report providing a fresh perspective on how the UK can...

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X-FAB Announces Upgrade to its Substrate Coupling Analysis Tool
X-FAB Silicon Foundries SE, an analog/mixed-signal and specialty foundry, has expanded the scope of its SubstrateXtractor tool, vi...

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Applied Materials Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors
Applied Materials, has introduced innovations that help customers continue 2D scaling...

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Silicon ISSUE 1
Volume 2022
Silicon Semiconductor Magazine
Featuring: Imec demonstrates significant performance gains utilizing backside 3D SOC interconnects; Sub-fab seals critical in handling complex chemistries at higher temperatures;Top semiconductor manufacturers improve design flow through IP management;Pandemic lessons learned will shape IC manufacturing well beyond 2022; Plus more...
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