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Weekly Newsletter
1st June 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
2D Experimental Pilot Line offers developers the chance to test graphene-based sensors

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Top News
Atotech and Schweitzer Engineering Laboratories announce business partnership

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This article was originally featured in Volume 2022
Issue 1 of Silicon Semiconductor Magazine.
MAGAZINE FEATURE
 
Contamination Management Solutions from Pfeiffer Vacuum
Pfeiffer Vacuum’s many years of experience as a provider of vacuum technology have shaped our know-how and understanding of the processes, equipment and environment of production systems. Based on this knowledge, we have developed solutions to identify and minimize contamination and increase the yield at each step of the process.

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Pandemic lessons learned will shape IC manufacturing well beyond 2022

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Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

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VIDEO

PEM Water Electrolysis Fills The Hydrogen Supply Gap for New and Expanding Fabs
This presentation will review the ease of use and the benefits associated with the reliance of hydrogen supply with an on-site Hydrogen gas generator utilizing PEM Technology. Attendees to the live event will receive a Professional Development Seminar Certificate of Completion Issued by Nel Hydrogen.

Watch Video
NEWSLETTER SPONSOR: CS International



CONNECTING THE CS INDUSTRY

Back in Brussels on 28th - 29th June 2022, CS International, will return for its eleventh year face-to-face!

With a pedigree stretching back more than a decade, CS International has firmly established itself as the leading conference covering all aspects of compound semiconductor device manufacturing.

At the next meeting, to be held in June 2022, presentations will cover five of the most important topics of our time: how to build faster, more frugal networks; what’s needed to drive the deployment of the microLED; how we will build a multi-billion dollar SiC industry; the opportunities for VCSELs and their surface-emitting cousins; and what are the best ways to exploit the glorious potential of GaN.

Throughout these five sessions, experts from our community will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; deliver an up-to-date overview of the status of the CS industry; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs.

Visit the website or info@csinternational.net for more details.



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ADDITIONAL NEWS

Electronics Supply Chain Challenges Are Getting Worse
Supplyframe has unveiled the results of its latest Commodity IQ Report that provides an overview of market dynamics (pricing, lead...

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Infineon revenue up in Q2 FY 2022
Infineon Technologies AG is reporting results for the second quarter of its 2022 fiscal year (period ended 31 March 2022). Q2 FY ...

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Teradyne Marks 7,000th J750 Semiconductor Test System Shipment
Teradyne, a supplier of automated test equipment, has announced the shipment of the 7,000th unit of its industry-leading J750 semi...

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SEMI Report: Silicon Wafer Shipments Edge to New Record in Q1 2022
Worldwide silicon wafer area shipments in the first quarter of 2022 surpassed the previous record high set in the third quarter of...

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“Onshoring” chip production is a red herring for UK
Imagination Technologies and Global Counsel have published a new research report providing a fresh perspective on how the UK can...

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Advantest Rolls Out ACS Adaptive Probe Cleaning
Semiconductor test equipment supplier Advantest has announced its industry-first ACS Adaptive Probe Cleaning (APC) solution to opt...

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X-FAB Announces Upgrade to its Substrate Coupling Analysis Tool
X-FAB Silicon Foundries SE, an analog/mixed-signal and specialty foundry, has expanded the scope of its SubstrateXtractor tool, vi...

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Applied Materials Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors
Applied Materials, has introduced innovations that help customers continue 2D scaling...

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Silicon ISSUE 1
Volume 2022
Silicon Semiconductor Magazine
Featuring: Imec demonstrates significant performance gains utilizing backside 3D SOC interconnects; Sub-fab seals critical in handling complex chemistries at higher temperatures;Top semiconductor manufacturers improve design flow through IP management;Pandemic lessons learned will shape IC manufacturing well beyond 2022; Plus more...
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