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Weekly Newsletter
30th June 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
Renesas Develops Circuit Technologies for 22-nm Embedded STT-MRAM

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Top News
Edge of Now: obstacles to AIoT market growth fall for third consecutive year

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This article was originally featured in Volume 2022
Issue 1 of Silicon Semiconductor Magazine.
MAGAZINE FEATURE
 
Contamination Management Solutions from Pfeiffer Vacuum

Pfeiffer Vacuum’s many years of experience as a provider of vacuum technology have shaped our know-how and understanding of the processes, equipment and environment of production systems. Based on this knowledge, we have developed solutions to identify and minimize contamination and increase the yield at each step of the process.



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Pandemic lessons learned will shape IC manufacturing well beyond 2022

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NUS researchers develop brain-inspired memory device that can revolutionise semiconductor design

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VIDEO

PEM Water Electrolysis Fills The Hydrogen Supply Gap for New and Expanding Fabs
This presentation will review the ease of use and the benefits associated with the reliance of hydrogen supply with an on-site Hydrogen gas generator utilizing PEM Technology. Attendees to the live event will receive a Professional Development Seminar Certificate of Completion Issued by Nel Hydrogen.

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NEWSLETTER SPONSOR: Pfeiffer Vacuum



Magnetically Levitated Turbopumps

Pfeiffer Vacuum ATH 2804 M/MT and ATH 3204 M/MT magnetically levitated turbopumps are designed for harsh semiconductor applications. They offer a gas throughput of over 5,000 sccm of nitrogen for non-heated applications and up to 1,500 sccm of argon at 65°C in corrosive applications. For high temperature, by-product deposition sensitive processes, the 85°C (MT model) is available.


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ADDITIONAL NEWS

Cadence Expands Collaboration with Arm
Cadence Design Systems has announced it has extended its collaboration with Arm to accelerate mobile device silicon success using ...

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Ansys Joins Intel Foundry Services Cloud Alliance
Ansys has announced that it has joined the Intel Foundry Services (IFS) Cloud Alliance. IFS is a fully vertical, standalone found...

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Strong Growth in 2021 for Physik Instrumente (PI)
The Physik Instrumente (PI) group finished the financial year 2021 with a plus in turnover of 27 percent. All the market segments ...

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PI Starts "Maximum On-Time Delivery" Initiative
With a comprehensive initiative, the PI Group is responding to the tight global supply situation. This is currently affecting the...

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Swagelok Company Celebrates 75th Anniversary - Company Marks Milestone by Growing Workforce on Cleveland’s West Side
Swagelok Company, a solutions provider of fluid system products, assemblies, and re...

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Brewer Science presents EUV lithography innovation
Brewer Science, a global supplier of next-generation materials and processes for the microelectronics and optoelectronics industri...

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AEM to Create Over 300 Additional Jobs with the Expansion
AEM to Create Over 300 Additional Jobs with the Expansion AEM, has announced its expansion plans. With a new site in Penang...

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Cadence Design IP portfolio in TSMC’s N5 Process Gains Broad Adoption
Cadence Design Systems has announced a wide range of leading semiconductor and syst...

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Silicon ISSUE 1
Volume 2022
Silicon Semiconductor Magazine
Featuring: Imec demonstrates significant performance gains utilizing backside 3D SOC interconnects; Sub-fab seals critical in handling complex chemistries at higher temperatures;Top semiconductor manufacturers improve design flow through IP management;Pandemic lessons learned will shape IC manufacturing well beyond 2022; Plus more...
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