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Newsletter: 18th July 2022
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INDUSTRY NEWS
  Report highlights opportunities for UK tech across Taiwan’s semiconductor sector
  Semiconductor giants add $1.1 trillion to stock values
  Imec.xpand launches EUR 300m fund
  Conference spotlights the latest Microelectronics Packaging Technologies

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COMPANY NEWS
  FTD solutions unveils Water Management as a Service
  Boosting smartphone performance
  Trident IoT launches Taurus Z-Wave Series silicon
  mechatronic systemtechnik unveils Fürnitz Technology Centre

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Samsung progresses developing silicon photonics for LiDAR
Microelectronics has revolutionized almost every aspect of life. Efforts to incorporate Silicon photonic integrated circuits (PICs) into advanced CMOS ICs often center on requirements that II-VI or III-V technologies cannot solely address. Computing, automotive, wellness and myriad other applications will or are already benefitting from integrated photonic devices that leverage various silicon or hybrid technologies. LiDAR is at an inflection point where further advances to reduce size and increase performance will hinge on new approaches like those envisioned by researchers at Samsung’s Advanced Institute of Technology who report on SiP advances on the road to better LiDAR PICs.
INTERVIEWS
  The path to power-efficient processing
  AP&S arrives in the US market
  Imec investigates the scope for sustainability improvements
  The importance of digital in creating a more sustainable future

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LAB NEWS
  CEA-Leti to report on latest packaging research
  CEA-Leti to coordinate 6G EU projects
  Quantum processor testing and measurement facilities up and running
  Manufacturing innovation centre focuses on electrification

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Edwards Vacuum Interview - Paul Neller

Mark Andrews, Editor of Silicon Semiconductor speaks to Paul Neller, VP of Semiconductor Division Marketing at Edwards V...

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