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Weekly Newsletter
21st July 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
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This article was originally featured in Volume 2022
Issue 3 of Silicon Semiconductor Magazine.
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ADDITIONAL NEWS

NXP Helps Standardize Next-Generation Security
NXP Semiconductors has announced that a specialized security algorithm co-authored by NXP security experts has been selected by NI...

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Global Semiconductor Sales Increase 18.0% Year-to-Year
The Semiconductor Industry Association (SIA) has announced global semiconductor industry sales were $51.8 billion in the month of ...

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Applied Materials Acquires Picosun
Applied Materials has announced it has acquired Picosun Oy, a privately held semiconductor equipment company based in Espoo, Fin...

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SwissSEM Selects Critical Manufacturing MES
Critical Manufacturing, a provider of Industry 4.0 focused Manufacturing Execution System (MES), has announced that SwissSEM has s...

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Cadence Expands Collaboration with Arm
Cadence Design Systems has announced it has extended its collaboration with Arm to accelerate mobile device silicon success using ...

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Ansys Joins Intel Foundry Services Cloud Alliance
Ansys has announced that it has joined the Intel Foundry Services (IFS) Cloud Alliance. IFS is a fully vertical, standalone found...

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Swagelok Company Celebrates 75th Anniversary - Company Marks Milestone by Growing Workforce on Cleveland’s West Side
Swagelok Company, a solutions provider of fluid system products, assemblies, and re...

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Brewer Science presents EUV lithography innovation
Brewer Science, a global supplier of next-generation materials and processes for the microelectronics and optoelectronics industri...

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Silicon ISSUE 3
Volume 2022
Silicon Semiconductor Magazine
Featuring: Avoid hydrogen shortages with on-site generation; Electroplating innovation enables ultrafine indium bonding; New micro-textured film enables universal bare die carriers; Plus more...
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