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Weekly Newsletter
8th August 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
Micron Ships World’s First 232-Layer NAND

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Top News
Smart sensors keep the pressure off

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This article was originally featured in 2022
Issue 3 of Silicon Semiconductor Magazine.
MAGAZINE FEATURE
 



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Avoid hydrogen shortages with on-site generation

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SFU researchers find the missing photonic link to enable all-silicon quantum internet

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Edwards Vacuum Interview
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ADDITIONAL NEWS

Renesas Announces New MCUs
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced the RZ/A3UL group of microprocess...

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U.S. Passes CHIPS Act, Increasing Restrictions on China
The disruption of the chip supply chain caused by the pandemic in the past two years, as well as geopolitical flashpoints such as ...

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Renishaw launches the inLux SEM Raman interface
Renishaw, in combining Raman spectroscopy with scanning electron microscopes (SEMs), have launched their latest product, the inLux...

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GlobalFoundries welcomes vote on legislation to bolster U.S. competitiveness
GlobalFoundries has released the following statement on the bipartisan procedural vot...

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Onto Innovation announces new acoustic metrology products
Onto Innovation has announced the next evolutionary step of innovative acoustic metrology products. The new Echo™ system further...

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Mouser Electronics and Allegro Announce Global Distribution Agreement
Mouser Electronics, a leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electroni...

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Advantest Adds System-Level Testing Capability for Advanced Memory ICs
Semiconductor test equipment supplier Advantest Corporation has installed its first e...

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STMicroelectronics and GlobalFoundries announce new 300 mm manufacturing facility in France
STMicroelectronics and GlobalFoundries have announced they have signed a Memorandum ...

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Silicon ISSUE 3
Volume 2022
Silicon Semiconductor Magazine
Featuring: Avoid hydrogen shortages with on-site generation; Electroplating innovation enables ultrafine indium bonding; New micro-textured film enables universal bare die carriers; Plus more...
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