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Weekly Newsletter
25th August 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
Intel signs agreement with Brookfield to jointly invest up to $30 billion

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Top News
OMNIVISION Announces World’s Smallest Global Shutter Image Sensor

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This article was originally featured in 2022
Issue 3 of Silicon Semiconductor Magazine.
MAGAZINE FEATURE
 



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Edwards sustainability programme reduces GHGs while cutting OpEx

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Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation

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VIDEO

Edwards Vacuum Interview
Mark Andrews, Editor of Silicon Semiconductor speaks to Paul Neller, VP of Semiconductor Division Marketing at Edwards Vacuum about the path to Fab sustainability that can increase profits while fighting climate change.

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NEWSLETTER SPONSOR: PE International



2023 PE International Conference Announced!

The power electronics industry is incredibly upbeat. Sales of silicon devices are continuing to climb, while revenue is rocketing for the more recent arrivals, SiC and GaN. At Power Electronics International we shall look at the factors behind this growth, the challenges that are arising, and what the future will hold. Delegates at this two-day conference will gain insights into the state of play and the opportunities that beckon through many dedicated talks and associated panel discussions covering the following five themes: Electric vehicles: Driving the SiC revolution; GaN: Carving out niches in consumer electronics; Safeguarding silicon's successes; Strengthening supply chains; and Perfecting the package.

Attendees at Power Electronics International will get plenty of opportunity to meet other key players within the community, and talk to providers of process equipment, materials and metrology tools in the exhibition hall.

Power Electronics International is part of the AngelTech series of events, which has produced for over a decade, a portfolio of insightful, informative, and highly valued chip-level conferences. Attracting more than 700 delegates, consisting of co-located Compound Semiconductor International, and Photonic Integrated Circuits International, plus a single exhibition area, delegates can dip in and out of every session to put together their own tailor-made programme by selecting from over 125+ invited talks, delivered by leaders of the most innovative global companies of today.

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ADDITIONAL NEWS

EV GROUP expands collaboration with ITRI
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has ...

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Volkswagen’s CARIAD and STMicroelectronics to co-develop chip
New cooperation model for software-defined cars: CARIAD, the software unit of Volkswagen Group, and STMicroelectronics, a global s...

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New Swagelok Valve Enables Manufacturers to Improve Chip Yield
Swagelok, a provider of fluid system products, assemblies, and related services, has announced the release of the Swagelok® ALD...

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Worldwide Semiconductor Revenue Growth to Slow
Global semiconductor revenue is projected to grow 7.4% in 2022, down from 2021 growth of 26.3%, according to the latest forecast f...

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Fraunhofer ENAS extends cooperation with memsstar
Fraunhofer ENAS and memsstar Limited are partnering. In order to ensure the quality of the reactive ion etching processes in MEMS ...

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GlobalFoundries Reports Announce Record Revenue
GlobalFoundries Inc. (GF) have announced preliminary financial results for the second quarter ended June 30, 2022. Key Second Q...

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Obducat receives order valued at €1.5 million
OBDUCAT AB (pub) subsidiary Obducat Europe GmbH, a leading supplier of system solutions for lithography processing, has rece...

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US President Signs CHIPS Act Into Law
US President Joe Biden signed the CHIPS and Science Act, a significant investment in the U.S. semiconductor industry. The legisla...

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Silicon ISSUE 3
Volume 2022
Silicon Semiconductor Magazine
Featuring: Avoid hydrogen shortages with on-site generation; Electroplating innovation enables ultrafine indium bonding; New micro-textured film enables universal bare die carriers; Plus more...
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