View this message online
Newsletter: 7th October 2022
FEATURED
New Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices

Semiconductor IC packaging techniques include the utilization of 3D integration to increase chip density, maximize performance and reduce power consumption

Read Article
INDUSTRY NEWS
•  imec Researchers debut key building block for deployment of 100G PON networks
•  Mycronic receives large order from Asia
•  EV GROUP and Toppan Photomask join forces
•  Vedanta to set up semiconductors and display fab units in India

View All Industry News
COMPANY NEWS
•  Brewer Science appointment to DOC Industrial Advisory Committee
•  Smart sensors for smarter industrial robotics
•  ASM completes acquisition of LPE
•  Sivers Semiconductors enters into a loan facility agreement

View All Company News


Next-generation low-k films can address present, future fabrication challenges
Smaller transistors packed more tightly into ever-shrinking packages are characteristic of new DRAM or logic devices
INTERVIEWS
•  Next-generation low-k films can address present, future fabrication challenges
•  Edwards sustainability programme reduces GHGs while cutting OpEx
•  Avoid hydrogen shortages with on-site generation
•  IC supply crunch? Engineering simulation helps ease the pain

View All Interviews
LAB NEWS
•  POLYN Technology Accepted into Silicon Catalyst Incubator Program
•  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
•  SFU researchers find the missing photonic link to enable all-silicon quantum internet
•  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

View All Lab News
VIDEO
Edwards Vacuum Interview

Mark Andrews, Editor of Silicon Semiconductor speaks to Paul Neller, VP of Semiconductor Division Marketing at Edwards Vacuum about the path to Fab sustainability that can increase profits while fighting climate change.

Watch Video
NEWSLETTER SPONSOR: Okmetic



Silicon wafer supplier Okmetic expands Its RFSi® portfolio

Silicon wafer supplier Okmetic expands Its RFSi® portfolio with Engineered Ultra High Resistivity wafer, a premium silicon substrate optimized for demanding RF filter and device needs. This highly advanced wafer technology combines over 10 kOhm-cm resistivity and optimized oxygen content with a highly efficient trap-rich layer. Engineered Ultra High Resistivity wafers leverage Okmetic’s proprietary A-MCz® crystal growth process to deliver the highest resistivity and best technical performance in the form of close to zero substrate-induced losses and nonlinearities for RF devices.



Visit Website
Silicon Semiconductor China
Volume - Issue 6/7
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
Silicon Semiconductor MAGAZINE
CORPORATE PARTNERS


Why not join our Corporate Partners?

Your logo will appear on every page of the Silicon Semiconductor Magazine website, every edition of the weekly email newsletter and all 5 editions of our magazine. Join today and receive fantastic visibility to the Silicon Semiconductor Industry.

Mark Andrews
Technical Editor
mark.andrews@amcsolutions.info 		  Shehzad Munshi
Sales Manager
shehzad.munshi@angelbc.com
 
Jackie Cannon
Director of Publishing
jackie.cannon@angelbc.com 		  Janice Jenkins
US Advertising Account Manager
jjenkins@brunmedia.com
 
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
AngelTech 2023   •   18th - 19th April 2023   •   Brussels, Belgium

Comprising of CS International (celebrating its 12th anniversary), PIC International (now in its 7th year), and the inaugral Power Electronics (PE) International.

AngelTech CS PIC PE
We hope that you found this newsletter of interest. If not, you may easily unsubscribe or manage your preferences here.

[COMPANY_ADDRESS]