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Newsletter: 27th October 2022
FEATURED
Amkor to support European semiconductor ecosystem

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INDUSTRY NEWS
  Cadence Expands Collaboration with Samsung Foundry
  Lam Research Pledges $10 Million to FIRST Global
  Imec demonstrates flat-panel-display-compatible pMUT technology
  Samsung Electronics Unveils Plans for 1.4nm Process

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COMPANY NEWS
  Nanometre components require sub-nanometre precision
  ALD TechDay for More-than-Moore devices
  Semiconductor Manufacturing Analytics Maturity: Common Barriers and Methods to Advance
  Gigaphoton develops analytics maturity model and assessment ebook

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Onto Innovation’s ‘XL’ fine resolution large field lithography dramatically cuts FOPLP pattern distortion
Heterogeneous integration enables multiple chips from varying Silicon processes to deliver superior performance
INTERVIEWS
  Next-generation low-k films can address present, future fabrication challenges
  Edwards sustainability programme reduces GHGs while cutting OpEx
  Avoid hydrogen shortages with on-site generation
  IC supply crunch? Engineering simulation helps ease the pain

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LAB NEWS
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
  SFU researchers find the missing photonic link to enable all-silicon quantum internet
  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

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VIDEO
Edwards Vacuum Interview - Paul Neller

Mark Andrews, Editor of Silicon Semiconductor speaks to Paul Neller, VP of Semiconductor Division Marketing at Edwards Vacuum about the path to Fab sustainability that can increase profits while fighting climate change.

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NEWSLETTER SPONSOR: SONOTEC



SEMICON Europa - Booth #C1735

Arrange a meeting with us at SEMICON Europa! We are looking forward to welcoming you at our booth #C1735 from November 15-18, 2022 at Messe Munich. Let’s discuss how our SEMIFLOW CO.65 clamp-on flow meter can assure the stability and high quality of your wet processes. The non-contact sensor for rigid plastic tubing eliminates any risks of leakages and contaminations, thus increasing uptime and maximizing yield. The compact sensor with integrated electronics can easily be implemented in existing process architectures.

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