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Newsletter: 4th November 2022
FEATURED
Micron ships advanced DRAM technology with 1β node

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INDUSTRY NEWS
  Amkor to support European semiconductor ecosystem
  Cadence Expands Collaboration with Samsung Foundry
  Lam Research Pledges $10 Million to FIRST Global
  Imec demonstrates flat-panel-display-compatible pMUT technology

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COMPANY NEWS
  KLA Launches New Double-Sided Direct Imaging Platform
  Nor-Cal Products Will Do Business as Pfeiffer Vacuum Valves & Engineering
  Park Systems Celebrates the Merger and Acquisition of Accurion GmbH
  Nanometre components require sub-nanometre precision

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New Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Semiconductor IC packaging techniques include the utilization of 3D integration to increase chip density, maximize performance and reduce power consumption
INTERVIEWS
  Next-generation low-k films can address present, future fabrication challenges
  Edwards sustainability programme reduces GHGs while cutting OpEx
  Avoid hydrogen shortages with on-site generation
  IC supply crunch? Engineering simulation helps ease the pain

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LAB NEWS
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
  SFU researchers find the missing photonic link to enable all-silicon quantum internet
  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

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VIDEO
Edwards Vacuum Interview - Alex Smith

Mark Andrews, Editor of Silicon Semiconductor speaks to Alex Smith, VP of Marketing, Service at Edwards Vacuum looking at the performance, optimisation and efficiency they are working towards.

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NEWSLETTER SPONSOR: SONOTEC



SEMICON Europa - Booth #C1735

Arrange a meeting with us at SEMICON Europa! We are looking forward to welcoming you at our booth #C1735 from November 15-18, 2022 at Messe Munich. Let’s discuss how our SEMIFLOW CO.65 clamp-on flow meter can assure the stability and high quality of your wet processes. The non-contact sensor for rigid plastic tubing eliminates any risks of leakages and contaminations, thus increasing uptime and maximizing yield. The compact sensor with integrated electronics can easily be implemented in existing process architectures.

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