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Newsletter: 18th November 2022
FEATURED
Lam Research Acquires SEMSYSCO to Advance Chip Packaging

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INDUSTRY NEWS
  Sensor Sales Stay Strong Due to Big ASP Rise
  Infineon planning a major investment in a new factory in Dresden
  TSMC Launches OIP 3DFabric Alliance
  Micron ships advanced DRAM technology with 1β node

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COMPANY NEWS
  Advantest Launches ACS Solution Store to Enable Real-Time Data Analytics Solutions
  EBARA presents DYNOX Gas Abatement System
  EV Group advances leadership in optical lithography
  ASM joins semiconductor climate consortium

View All Company News


Cutting FOPLP pattern distortion
Heterogeneous integration enables multiple chips from varying Silicon processes to deliver superior performance
INTERVIEWS
  DuPont reshapes IC materials manufacturing for post-COVID success
  Cutting FOPLP pattern distortion
  Critical Manufacturing redefines semiconductor MES for greater agility, success
  Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices

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LAB NEWS
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
  SFU researchers find the missing photonic link to enable all-silicon quantum internet
  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

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VIDEO
Edwards Vacuum Interview - Alex Smith

Mark Andrews, Editor of Silicon Semiconductor speaks to Alex Smith, VP of Marketing, Service at Edwards Vacuum looking at the performance, optimisation and efficiency they are working towards.

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NEWSLETTER SPONSOR: PIC International



PIC International

The PIC International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning 4 sectors.

Attendees at the two-day conference will gain an up-to-date overview of the status of the Photonics industry, and will have the opportunity to meet many other key players within the community.

PIC International is part of AngelTech, which delivers a portfolio of insightful, informative, highly valued chip-level conferences. Bringing together 3 conferences, 700+ delegates, 80+ exhibitors, 120+ presentations and numerous networking opportunities, AngelTech is the number one global event covering compound semiconductor, photonic integrated circuit and sensor technologies. With a strong over-lap between the three conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.


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  Shehzad Munshi
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