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Newsletter: 3rd January 2023
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Imec enables tight standard cell boundary scaling

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INDUSTRY NEWS
•  Trends in the semiconductor industry
•  Sensor Sales Stay Strong Due to Big ASP Rise
•  Lam Research Acquires SEMSYSCO to Advance Chip Packaging
•  Infineon planning a major investment in a new factory in Dresden

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COMPANY NEWS
•  Photonis announces agreement to acquire Xenics, a leader in Infra-Red imaging solutions
•  Xenics introduces Wildcat+ 640
•  Phlux Technology Secures £4m in Seed Funding
•  Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects

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Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Semiconductor IC packaging techniques include the utilization of 3D integration to increase chip density, maximize performance and reduce power consumption
INTERVIEWS
•  DuPont reshapes IC materials manufacturing for post-COVID success
•  Cutting FOPLP pattern distortion
•  Critical Manufacturing redefines semiconductor MES for greater agility, success
•  Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices

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LAB NEWS
•  POLYN Technology Accepted into Silicon Catalyst Incubator Program
•  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
•  SFU researchers find the missing photonic link to enable all-silicon quantum internet
•  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

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