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Newsletter: 5th January 2023
FEATURED
TSMC holds 3nm volume production and capacity expansion ceremony

Marks a key milestone for advanced manufacturing

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INDUSTRY NEWS
  Arm Holdings to power Saudi Arabia’s healthcare transformation
  Brewer Science presents 'Future of Water Condition Monitoring' at CES 2023
  Magnachip introduces 8th-Gen 150V MXT MOSFET for light electric vehicles
  First EUV light marks key milestone for production of Intel 4 in Europe

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COMPANY NEWS
  Toshiba to expand power semiconductor production capacity
  UMC leads (again) semiconductor foundries in the 2022 Dow Jones Sustainability Indices
  VIS joins RE100 and pledges to source 100% renewable energy by 2040
  TI’s latest 300-millimeter wafer fab in Lehi, Utah, begins production

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Next-gen low-k films can address present, future fabrication challenges
Smaller transistors packed more tightly into ever-shrinking packages are characteristic of new DRAM or logic devices
INTERVIEWS
  DuPont reshapes IC materials manufacturing for post-COVID success
  Cutting FOPLP pattern distortion
  Critical Manufacturing redefines semiconductor MES for greater agility, success
  Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices

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LAB NEWS
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
  SFU researchers find the missing photonic link to enable all-silicon quantum internet
  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

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VIDEO
Edwards Vacuum Interview - Alex Smith

Mark Andrews, Editor of Silicon Semiconductor speaks to Alex Smith, VP of Marketing, Service at Edwards Vacuum looking at the performance, optimisation and efficiency they are working towards.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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